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This paper presents two newly developed technologies of optimizing impurity diffusion concentration for silicon semiconductor material and controlling internal stress of the top SiN (Silicon Nitride) layer on a membrane of a silicon substrate to apply them to the manufacturing process of MEMS (Micro Electro Mechanical Systems) type air-flow sensor chips. Until today, in MEMS-type airflow sensors, poly-crystalline silicon (poly-Si) and platinum were widely used as a resistor material of key functional elements on a membrane of air-flow-rate measurement portion. The functional resistors on the membrane are required to monitor high temperatures of about 300 °C and to perform the self-heating operations at that temperature range because of the suppression of contaminant deposition by means of evaporation or incineration.

In electronic products, the recently increasing thermal radiation demands higher thermal conductivity of polymer composites. However, inaccurate observation of the filler dispersion within the polymer does not allow for accurate quantification of Interface Thermal Resistance and subsequently the prediction of thermal conductivity. Therefore, optimum filler design could not be achieved. Firstly in this report, accurate stereoscopic filler dispersion was observed by FIB-SEM. Secondly, quantification of Interface Thermal Resistance could be achieved by thermal conduction analysis using filler dispersion model. Thirdly, this Interface Thermal Resistance enabled the prediction of the thermal bulk conductivity. Lastly, the prediction made above could be validated by comparison of predicted value to measured value. This result may lead to optimum filler design and thereby to the development of higher thermal radiation materials.

This paper describes the newly developed processes of low temperature wafer bonding using plasma activation and deep dry silicon etching technologies. Both processes are a new type of “MEMS” (Micro Electro Mechanical System) process technology suitable for automotive pressure sensors. The conventional pressure sensor was a unified unit consisting of a silicon sensor chip and a glass stage. The diced unified unit was cut from a bonded disk of a processed silicon wafer and a glass stage substrate, and the silicon sensor chip incorporated four piezo-resistors, a diaphragm and bipolar-circuit. However, the pressure sensor had difficulty in accurately measuring pressure in the high temperature range because of the thermal strain caused by the thermal expansion coefficient difference between the silicon sensor chip and the glass stage.

Increased interest in global warming requires rapid improvements in CO2 reduction efforts. The automotive industry is placing high importance on CO2 reduction technologies. Using Lithium-ion (Li-ion) battery pack Stop & Start (S&S) system with combined energy regeneration is an effective technology to reduce CO2 emissions. Power supply storage is very important for the S&S system. High charging acceptance, low weight, and compact size are required. A Li-ion battery is the optimal power supply that meets these requirements. It has high charge acceptance per weight. Furthermore, we developed simple system structure which eliminates the need for the DC-DC converter. By utilizing a Li-ion battery that has voltage characteristics similar to the Pb battery there is no need for a converter to make adjustments between the two power supplies. The Li-ion battery's range of capacity must be managed appropriately as overcharge and overdischarge causes extensive damage to the battery.

The demand for better driving comfort, fuel efficiency and reduced CO2 output has been becoming increasingly stringent. In response to such needs, we developed Transmission Electro-Hydraulic Control Module (TEHCM). For Automatic Transmission, expanding the lock-up control area is necessary to improve fuel efficiency. Meanwhile, lock-up control at lower speeds aggravates shift quality. To improve shift quality, Automatic Transmission Fluid (ATF) pressure control must be precise is needed. This can be accomplished by compensating for deviation in TEHCM, which integrates Transmission Control Unit (TCU) and the pressure control actuator, Variable Force Solenoid (VFS). However, there are two problems in installing TEHCM in compact vehicle. The first problem is the miniaturization of such TEHCM. Regarding modules that require a high electrical current to operate the VFS, thermal conductivity contradicts miniaturization.