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Technical Paper

Advanced Material Properties Measurements with Optical Metrology

2011-04-12
2011-01-0997
Materials are advancing at a record rate, with unimagined complexity even in now standard materials. Traditional measurement tools can only get approximate material properties. Core to all proper design and accurate computer modeling is a base understanding of accurate material properties. Full-field optical measurement tools using 3D digital image correlation (DIC) is able to provide a more complete measurement and analysis of these advanced materials, providing precise material properties at all scales. This paper will review microscopic analysis of crystalline behavior, coupon testing of dog bone specimens and large scale materials measurements in stamping operations. In addition, the measurement of extreme materials properties, such as high-speed forming limit curves and deep drawing properties will be discussed. Key to all of these measurements are the associated standards that control them; these will be discussed.
Technical Paper

Next Generation 3D Optical Measurements for Manufacturing

2005-04-11
2005-01-0490
Materials qualification, forming analysis, component and structural testing, advanced video metrology systems utilizing photogrammetry and image correlation provide robust full-field measurement capabilities for broad ranges of measurement applications. These advanced techniques of 3D image correlation (ARAMIS) for 3D deformation and strain measurement, photogrammetry (ARGUS) for automated forming analysis for manufactured parts and dynamic photogrammetry (PONTOS), are substantially more robust and provide a greater dynamic range than other technologies, and are simpler to use and less expensive to implement. The technologies are inherently three-dimensional, measuring total deformation of complex objects and their shape, rather than just relative deformation. The technology also has a much higher dynamic range of deformation measurement, which is particularly critical during dynamic deformation analysis such as during systems analysis, plastic deformation and defect propagation.
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