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A practical modeling methodology for adhesively bonded structures using discrete springs has been developed for crash simulation. As a first step, a series of coupon tests with adhesively bonded substrates have been conducted under tension, peel and shearing. Both deformable and rigid substrates have been used in these tests. The resulting data has been used to determine the properties of the adhesive springs. A set of numerical simulations of the coupon tests have been conducted to verify that the adhesive spring properties derived earlier do indeed represent the mechanical properties of the physical adhesives in the coupon tests.