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This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.

The increasing legal requirements for safety, emission reduction, fuel economy and onboard diagnostic systems are forcing the market to increase complexity. This complexity must not be a reason for slowing down the introduction of new systems. For efficiency, car manufacturers and system suppliers want to focus on their core competencies and leave the micro-controller complexity to silicon vendors. Competition forces system suppliers to jump to the most “function/cost” effective solution. For this reason it is very dangerous to move in the direction of specific solutions which require a large amount of effort to modify. Therefore the market goes in the direction of standards with clear interfaces. The approach presented overcomes these obstacles by introducing a Configurable I/O System (CIOS) layer. The CIOS encompasses basic software driver objects for engine management systems encapsulating the standard sensors and actuators.