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Meeting specific bonded insulator attachment specifications depend on the type of bonding polymer selected as well as application conditions. These conditions include initial apply parameters (time, temperature and pressure), backing plate surface characteristics (surface material, flatness, finish) and strength properties that avoid cohesive, adhesive or mixed mode failures during operating life of the braking pad assembly. “T-pull” and “Lap Sheaf testing provide an overall quantitative method to determine tensile and shear load/deflection properties. They do not assess the three dimensional dynamic stress state of the bond during braking conditions which involve the influence of temperature, apply pressure, rotational inertial forces and cyclic frequency/strain rate effect. The operational factors which change the state of bond have an effect on damping performance and ability to control overall system noise.