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The electrical architecture design of a rear back glass defrost grid system encompasses many critical criteria that must be integrated into the design. For example, the defrost clip location and interface to the glass must meet all vehicle performance requirements. If the defrost clip to the glass interface is not resistant to vibration and relative movement, detachment and loss of function can occur. This paper describes a back glass defrost clip with a solder joint that is robust to manufacturing variations and customer usage conditions. A designed experiment using Design for Six Sigma methodologies was performed to understand the effects of the attachment interface to the electrical wiring pigtail, and parameters that affect performance. The working constraints, testing set up, validation, and root cause investigation of the clip detachment phenomenon is covered in this paper.