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One low-copper formulation and one copper-free formulation were made into disc pads, and both of them were cured under 4 different conditions. These pads had no backing layer and no scorched layer. Pad thickness, dynamic modulus and natural frequencies were continuously monitored over a period of 12 months. After 12 months at room temperature, pad thickness, dynamic modulus and natural frequencies all increased to higher values. The low-copper formulation increased relatively rapidly during the first 60 days and the copper-free formulation increased relatively rapidly for the first 90 days, and then slowly thereafter. Two competing processes are found to be taking place simultaneously; internal stress relief leading to pad expansion and cross-linking of the resin leading to pad shrinkage. As the pad properties are changing continuously, the timing of property measurement becomes an important issue for quality assurance.