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The technology development work carried out within the framework of the European EVA System predevelopment activities and complemented with additional analyses and trades have resulted in an improved technical reference concept for the preparation of the Phase C/D activities. The results of the technology breadboard model testing have been used to verify or alter the overall space suit design concept.

One of the most important driving factors in space suit design rests upon the packaging of life support and electrical components within the compartments of a space suit system. The volume and mass of space suits are restricted due to payload constraints, volume constraints inside the airlock, limited hatch diameter, and general bulkiness of the mini spacecraft ‘space-suit’. The need for a higher packaging density becomes even more important with the implementation of failure tolerance principles, like redundant components, or design for minimum risk. Special attention has to be paid to the heat balance of motors, pumps, heat exchangers, converters, etc. so as to avoid heat accummulation as well as heat sinks inside the backpack or the suit enclosure. However, from a maintenance point of view, packaging has a certain upper limit in terms of reachability and replaceability of failed or to be maintained components.