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The purpose of this procedure is to establish a technique for reliably and repeatedly measuring the RF shielding characteristics of EMI gasket materials and EMI gaskets against various joint surfaces. The procedure is also used to test the reliability of the gasketed joint combinations after being subjected to hostile environments.

The purpose of this procedure is to establish a technique for reliably and repeatedly measuring the RF shielding characteristics of EMI gasket materials and EMI gaskets against various joint surfaces. The procedure is also used to test the reliability of the gasketed joint combinations after being subjected to hostile environments.

This specification covers protective shields for engine and tailpipe openings of aircraft and missiles.

This document establishes the minimum requirements for the electrical bonding and grounding of electric, avionic, armament, communication, and electronic equipment installations for aeronautical and aerospace applications. The bonding and grounding requirements specified herein are to ensure that an adequate low resistance return path for electric, avionic, armament, communication and electronic equipment is achieved which can withstand operating conditions and corrosion. This is essential for the reduction of coupling of electromagnetic fields into or out of the equipment as well as for providing electrical stability to control the currents and/or voltages caused by static charges and discharges and for suppressing the hazardous effects thereof.