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State-of-the-art and (notional) future receiver architectures have increasingly challenging power consumption and power density requirements under the constraints of limited air vehicle resources. In addition, there is a trend to increase functionality requirements by implementing ongoing technology enhancements and realizing more advanced system and processor architectures. These ongoing developments, in turn, require the development of advanced thermal management and analysis techniques in order to address the resulting systems implementation and integration issues. The analysis presented in this paper is motivated by these continual advances in solid state technology that push for evolving specifications in system size reduction, increasing processor speed, and the increased desire to design “smart” or “intelligent” sensors and subsystems that have superior versatility.

As the United States Air Force (USAF) in addition to the rest of DoD and American society become increasingly dependent on smaller, faster, cheaper, higher-performing integrated circuits (IC), digital, technologies that have more functionality, we must not overlook the fact that better-performance does not come without its price. In this paper, we discuss the integrated circuit; solid-state and IC history; IC functionality; IC manufacturing process; and silicon and silicon dioxide heat transfer rates. We discuss customized ICs such as Field Programmable Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), and Micro-Electro-Mechanical Systems (MEMS). We discuss the Fourier heat equation. We discuss how increasing the numbers of transistors and their support components increases the density relating to the interior of such semiconductor materials.