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As the United States Air Force (USAF) in addition to the rest of DoD and American society become increasingly dependent on smaller, faster, cheaper, higher-performing integrated circuits (IC), digital, technologies that have more functionality, we must not overlook the fact that better-performance does not come without its price. In this paper, we discuss the integrated circuit; solid-state and IC history; IC functionality; IC manufacturing process; and silicon and silicon dioxide heat transfer rates. We discuss customized ICs such as Field Programmable Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), and Micro-Electro-Mechanical Systems (MEMS). We discuss the Fourier heat equation. We discuss how increasing the numbers of transistors and their support components increases the density relating to the interior of such semiconductor materials.