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Technical Paper

Cold Start Thermal Management with Electrically Heated Catalyst: A Way to Lower Fuel Consumption

2013-09-08
2013-24-0158
Recent engine development has been mainly driven by increased specific volumetric power and especially by fuel consumption minimization. On the other hand the stringent emission limits require a very fast cold start that can be reached only using tailored catalyst heating strategy. This kind of thermal management is widely used by engine manufactures although it leads to increased fuel consumption. This fuel penalty is usually higher for high power output engines that have a very low load during emission certification cycle leading to very low exhaust gas temperature and, consequently, the need of additional energy to increase the exhaust gas temperature is high. An alternative way to reach a fast light off minimizing fuel consumption increase is the use of an Electrical Heated Catalyst (EHC) that uses mechanical energy from the engine to generate the electrical energy to heat up the catalyst.
Technical Paper

Innovative Metallic Substrate Technology to Meet Future Emission Limits

2007-10-30
2007-32-0054
Exhaust after-treatment systems will have to become increasingly efficient in order to comply with the strict emission limits that will apply in the European Union and worldwide in future. Moreover, space constraints, weight and low pressure drop are just some of the issues that have to be addressed by an EU III-compliant catalytic system. The development of metallic substrates over the past few years has shown that turbulent-like substrates increase specific catalytic efficiency. This has made it possible to enhance overall performance for a specific catalytic volume or reduce the volume while keeping catalytic efficiency constant. This paper focuses on the emission efficiency of standard, TS and PE metallic substrates. A simulation tool and flow bench measurements were used to develop a test matrix with catalyst similar pressure drop in order to examine different cell densities, substrate lengths and coating technologies.
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