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This paper reviews MEMS product applications in a very demanding automotive environment. Our particular interest is in the MEMS inertial and pressure sensors. Specifics of transducer manufacturing technologies will be explained in details. Also advantages and disadvantages of piezoresistive versus capacitive sensing phenomena will be discussed. Finally, main aspects of the packaging effects on the final device parameters and performance are considered too.

A monolithic sensing solution for manifold absolute pressure (MAP) is presented. This work includes examination of design, fabrication, temperature compensation, packaging and electromagnetic compatibility (EMC) testing of the fully integrated monolithic sensor. The circuit uses integrated bipolar electronics and conventional IC processing. The amplification circuit consists of three op-amps, seven laser trimmable resistors, and other active and passive components. Also discussed is a summary of an automotive application MAP sensor general specification, test methods, assembly, packaging, reliability and media testing for a single chip solution.