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Technical Paper

System Evaluation of Cavitation Enhanced Heat Transfer in Microchannels

2006-11-07
2006-01-3062
Mainstream Engineering Corporation and Rensselaer Polytechnic Institute previously introduced a new method of enhancing two-phase heat transfer in microchannels. Micro-orifices, 20 μm wide, were entrenched at the inlet of 227-μm (hydraulic diameter) microchannels to provide flow stability and induce hydrodynamic cavitation. Significant heat transfer enhancement was recorded during supercavitating flow conditions in comparison to non-cavitating flows with minimal pressure-drop penalty. This paper examines the usefulness of this approach from a systems perspective. Results are compared to predicted values in microchannel passages without orifices. Recommendations are made to improve the performance of the entire thermal management system.
Technical Paper

Comparative Analysis of Thermal Management Architectures to Address Evolving Thermal Requirements of Aircraft Systems

2008-11-11
2008-01-2905
Recent advances in aircraft technology have raised much concern over the manner in which aircraft thermal management is carried out. These advances range from the incorporation of high-power electronics to transporting thermal loads at high temperatures. These types of technological advances have brought about a necessity for new aircraft thermal management architectures in order to maintain reasonable cost, size, weight, and power requirements of the overall system. The objective of this study is to address the requirements and performance aspects of existing system configurations in an effort to identify inefficiencies and highlight potential areas for improvement. As a result of this study, a new aircraft thermal management architecture, which can best be described as a vapor-compression thermal bus, is proposed as a replacement for existing technology.
Technical Paper

The Evolution of Microchannel Heat Transfer

1999-04-06
1999-01-1357
High-density electronics packaging requires new advancement in thermal management. New efforts to standardize three-dimensional electronics packages provide the opportunity to standardize thermal management systems for the first time. Microchannel cooling, a high heat flux technology, is the leading candidate for standardization of earth- and space- based electronics packages. This paper looks at the developments in microchannel cooling that make it more advantageous than other high heat flux techniques and the work that remains to achieve a standardized thermal management system.
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