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This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). Failure-Mechanism-Driven Reliability Monitoring draws upon the concepts and implementation of line controls, process stability, and effective monitoring programs in lieu of qualifying a product based solely on a fixed list of tests. A supplier must identify those failure mechanisms that may be actuated through a given product / process change(s), and must design and implement reliability tests adequate to assess the impact of those failure mechanisms on system level reliability. In order for this to be effective, the supplier establishes a thorough understanding of and linkage to their reliability monitoring program.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). Failure-Mechanism-Driven Reliability Monitoring draws upon the concepts and implementation of line controls, process stability, and effective monitoring programs in lieu of qualifying a product based solely on a fixed list of tests. A supplier must identify those failure mechanisms that may be actuated through a given product / process change(s), and must design and implement reliability tests adequate to assess the impact of those failure mechanisms on system level reliability. In order for this to be effective, the supplier establishes a thorough understanding of and linkage to their reliability monitoring program.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.