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Referee Material

EA-24 User's Manual for the BIOSID Side Impact Test Dummy (Sept. 2007)

1991-05-01
User's Manual for the BIOSID Side Impact Test Dummy (Sept. 2007) SAE Product Code: EA-24 This 42 page user's manual covers the Biosid 50th Percentile Male side impact crash test dummy. It is intended for use by technicians who work with this device. It covers the construction, assembly and disassembly, available instrumentation, external dimensions and segment masses, as well as calibration test procedures.
Referee Material

Eyellipse and Head Contour Locator Line - Adjustable Seat

1977-05-01
Eyellipse and Head Contour Locator Line - Adjustable Seat SAE Product Code: EA-5 The EA-5 is a drafting tool that describes the position of the eyellipse and the occupant head contour for horizontally adjustable seats with back angles between 5 and 40 degrees. Note! This product will be discontinued when current stock is depleted.
Referee Material

Four Head Position Contour Templates (Set of 4)

1977-05-01
SAE J1052 Mar87 Motor Vehicle Driver and Passenger Head Position SAE Product Code: EA-6 The templates are two-dimensional shapes that describe the seated vehicle occupant head positions in side and rear view. The driver head position contours with seat travel apply to drivers in horizontally adjustable seats. The head position contours without seat travel apply to both drivers and passengers in fixed seats. Note! This product will be discontinued when current stock is depleted. The templates are two-dimensional shapes that describe the seated vehicle occupant head positions in side and rear view. The driver head position contours with seat travel apply to drivers in horizontally adjustable seats. The head position contours without seat travel apply to both drivers and passengers in fixed seats.
Standard

LOGICAL SOFTWARE PART PACKAGING FOR TRANSPORT

2020-11-16
CURRENT
ARINC641-1
The purpose of this standard is to provide a method for packaging aircraft software parts for distribution using contemporary media or by electronic distribution. This project intends to standardize and provide guidance for the storage of floppy based software, currently packaged in media set parts. This standard format can be then stored or distributed on a single physical media member (CD-ROM), or by electronic crate. The obsolescence of floppy disks drive an urgent need for this guidance.
Standard

Manufacturing Message Specification – Service Definition and Protocol

2016-06-28
CURRENT
EIA511
The Manufacturing Message Specification is an application layer Standard designed to support messaging communications to and from programmable devices in a Computer Integrated Manufacturing (CIM) environment. This environment is referred to in this Standard as the manufacturing environment. This Standard does not specify a complete set of services for remote programming of devices, although provision of such a set of services may be the subject of future standardization efforts.
Referee Material

EA-28 User's Guide for the Six Month Old Infant Dummy (CRABI) (June 1995)

1995-06-01
User's Guide for the Six Month Old Infant Dummy (CRABI) (June 1995) SAE Product Code: EA-28 This 31 page user's manual covers the 6-month-old Child Restrain Air Bag Interaction (CRABI) infant dummy. It is intended for use by technicians who work with this device. It covers the construction and clothing, assembly and disassembly, available instrumentation, external dimensions and segment masses, as well as calibration test procedures. It includes instructions for joint adjustment and skin repair.
Collection

Biomechanics, 2010

2010-06-01
This technical paper collection contains 11 papers that focus on occupant protection biomechanics.
Video

High Temperature Power Device and Packaging - The Technology Leap to Achieve Cost, Power Density and Reliability Target

2011-11-07
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.
Video

Introduction of New Concept U*sum for Evaluation of Weight-Efficient Structure

2011-11-01
A new index for evaluating load path dispersion is proposed, using a structural load path analysis method based on the concept of U* , which expresses the connection strength between a load point and an arbitrary point within the structure enables the evaluation of the load path dispersion within the structure by statistical means such as histograms and standard deviations. Presenter Tadashi Naito, Honda R&D Co., Ltd.
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