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In this paper, a new method for determining the forming limit diagram (FLD) of thin sheet metals, called DIC-Grid method, is proposed based on digital image correlation (DIC) technique. It's assumed that there exists one virtual grid with an initial diameter of 2.5mm, which is usually the same dimension as the grid in traditional circular grid analysis, close to the crack of specimen, and the limit strain point on FLD is determined by the deformation of this virtual grid. The DIC-Grid method has been compared with traditional circular grid analysis and the standard ISO/FDIS 12004-2 in Nakajima tests. The results show that the forming limit strains obtained by the newly proposed method are more stable and precise. Furthermore, DIC-Grid method can avoid the measurement error which exists in the circular grid analysis. Meanwhile, it overcomes the shortcomings of time-consuming data processing and non-applicable for unrealistic strain distribution in the method of ISO standard.

Adhesive bonding has many applications in the automotive industry. The single-lapped bonded joint is the most typically used among various bonding types. This paper presents experimental research for determining the strain field of the single-lapped joint under tensile loading. The materials for the joint are epoxy-based structural adhesive and low-carbon electrolytic zinc steel plate. In the study, a DIC (digital image correlation) system was adopted to measure the strain distribution of the bonded joint during a tensile test. The bonded steel coupons in the tensile test were prepared according to the ASTM standard. During the measurement, images of the coupon joint were taken before and after the deformation process. Then the DIC system measured the strain of bonded joint by comparing two consecutive images. The measured data from the DIC was compared to data taken simultaneously from a traditional extensometer.