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The electronic content in automotive has increased over recent years and expected to contribute about 50% of the total vehicle cost by 2030. The semiconductor research indicates that focus is on enhancing the functionality of single device and miniaturizing of components to reduce the electronic module size. It is to be ensured, that devices in automotive electronic modules should be within its allowable temperature limit while operating at harsh environment. The accurate virtual simulations using CAE tools prior to proto build can assist in understanding the design risks upfront and aids in arriving at a reliable thermal mitigation solution. The prediction accuracy of thermal simulation is driven by the inputs and modeling approach used in the analysis. Current automotive electronic product development trend indicates, chip development and thermal design of electronics module goes in parallel.