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A unified approach has been developed and applied to solder joint life prediction in this paper, which indicates a breakthrough for solder joint reliability simulation. It includes the material characterization of solder alloys, the testing of solder joint specimens, a unified viscoplastic constitutive framework with damage evolution, numerical algorithm development and implementation, and experimental validation. The emphasis of this report focuses on the algorithm development and experimental verification of proposed viscoplasticity with damage evolution.

Shearography is an interferometric, non-contact and full field method for direct measurement of first derivatives of deformation (strain). It is relatively insensitive to environmental disturbances and has been proven to be a practical measuring tool for nondestructive testing and evaluation (NDT/NDE). In this paper it has been employed to study the thermal residual strains produced during the reinforcement of a composite to a sheet metal. The reinforced composite is used as an additive to provide extra strength to the sheet metal. The reinforcement process involves gradual heating of the glued composite to a temperature of around 175°C - 180°C and then allowing it cool down to room temperature. During the heating process both the composite and the sheet metal are strained, but during the cooling process some amount of strain is left behind in the sheet metal and it has a key role to play when the product is used for critical parts in automobile and aircraft industries.