New Accelerometer Based on Innovative Packaging and Circuit Design 951018
A signal-conditioned accelerometer is described which offers many advantages to the user. The sensor element, manufactured using silicon micromachining, has proven reliability. The signal conditioning does not require external components and thick or thin film technology but is done entirely within a monolithic IC. The sensor and signal conditioning chips are hermetically packaged together in a ceramic leadless chip carrier. The output parameters are trimmed electrically after packaging is completed. The chip carrier can be mounted in several orientations to allow measurement of acceleration either perpendicular to or in plane with the mounting surface.
Citation: de Bruin, D. and Dunbar, M., "New Accelerometer Based on Innovative Packaging and Circuit Design," SAE Technical Paper 951018, 1995, https://doi.org/10.4271/951018. Download Citation
Author(s):
Diederik W. de Bruin, Michael L. Dunbar
Affiliated:
EG&G IC Sensors
Pages: 7
Event:
International Congress & Exposition
ISSN:
0148-7191
e-ISSN:
2688-3627
Related Topics:
Packaging
Logistics
Sensors and actuators
Ceramics
Vehicle acceleration
Reliability
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