In this report we focus on development of smaller and lighter ECUs for Automatic Trans-Missions (ATM).
Specifically, we describe the development of ECUs that utilize: detailed printed wire patterns, bare chip semiconductors with wire bonding technology, and many small Surface Mounting Devices (SMDs), on a metal based board with high heat dissipation.
In comparison with our current products, we have achieved:
a 58% reduction in size, a 63% reduction in weight,
a 58% reduction in size,
a 63% reduction in weight,
These new ECUs are suited for the severe environment of the engine compartment.