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In automobiles, Integrated Starter Generators (ISGs) are important components since they ensure significant fuel economy improvements. With motors that operate at high voltage such as ISGs, it is important to accurately know partial discharge inception voltages (PDIVs) for the assured insulation reliability of the motors. However, the PDIVs vary due to various factors including the environment (temperature, atmospheric pressure and humidity), materials (water absorption and degradation) and voltage waveforms. Consequently, it is not easy either empirically or analytically to ascertain the PDIVs in a complex environment (involving, for example, high temperature, low atmospheric pressure and high humidity) in which many factors vary simultaneously, as with invehicle environments. As a well-known method, PDIVs can be analyzed in terms of two voltage values, which are the breakdown voltage of the air (called “Paschen curve”) and the shared voltage of the air layer.

Measurements of residual stress in a printed circuit board, which consists of copper foil, silver alloy and thermo plastic resin, were conducted under a thermal cycle. The printed circuit board was given a ten-layer repeat of prepreg and made by thermocompression bonding. Experiments suggested the possibility of measuring surface residual stress of copper circuits and the internal residual stress of metallic connections by synchrotron radiation of Spring-8. FEM analysis of the printed circuit board during a thermal cycle was conducted, and the result was adjusted to X-ray stress using absorption correction. X-ray stress during a heat-cycle obtained by synchrotron radiation showed good agreement with stress calculated by FEM analysis.