Search Results

With the advent of wide band gap semiconductor devices like SiC based MOSFETs/Diodes, there is a growing demand for utilizing electrical power instead of the conventional fuel-based power generation in both automotive and aerospace industry. In automotive/aerospace industry the focus on electrification has resulted in a need for sub-systems like inverters, power distribution units, motor controllers, DC-DC converters that actively utilize SiC based power electronics devices. To address the growing power density requirements for electronics in next generation product families, more efficient & reliable thermal management solution plays a critical role. The effective thermal management of the power electronics is also critical aspect to ensure overall system reliability. The conventional thermal management system (TMS) optimization targets heat sink/ cold plate design parameters like fin spacing, thickness, height etc. or sizing of the required cooling pump/fan.