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A main challenge when developing next generation architectures for automated driving ECUs is to guarantee reliable functionality. Today’s fail safe systems will not be able to handle electronic failures due to the missing “mechanical” fallback or the intervening driver. This means, fail operational based on redundancy is an essential part for improving the functional safety, especially in safety-related braking and steering systems. The 2-out-of-2 Diagnostic Fail Safe (2oo2DFS) system is a promising approach to realize redundancy with manageable costs. In this contribution, we evaluate the reliability of this concept for a symmetric and an asymmetric Electronic Power Steering (EPS) ECU. For this, we use a Markov chain model as a typical method for analyzing the reliability and Mean Time To Failure (MTTF) in majority redundancy approaches. As a basis, the failure rates of the used components and the microcontroller are considered.

Driven by the growing internet and remote connectivity of automobiles, combined with the emerging trend to automated driving, the importance of security for automotive systems is massively increasing. Although cyber security is a common part of daily routines in the traditional IT domain, necessary security mechanisms are not yet widely applied in the vehicles. At first glance, this may not appear to be a problem as there are lots of solutions from other domains, which potentially could be re-used. But substantial differences compared to an automotive environment have to be taken into account, drastically reducing the possibilities for simple reuse. Our contribution is to address automotive electronics engineers who are confronted with security requirements. Therefore, it will firstly provide some basic knowledge about IT security and subsequently present a selection of automotive specific security use cases.

The market potential for products such as scooters and small motorcycles is already self-sustaining. However, other applications for small engines can be more fragmented with a wide variety of requirements for the engine control unit. Consequently, the engine control unit can be designed to accommodate more features than are necessary for a given application to cover a broader market. The flip side of this approach is to design the engine control unit for a limited application reducing the market size. Neither approach creates a cost efficient product for the producer. It either supplies the market with an electronic control unit that has features not being utilized (wasted costs) or a unit that has limited capabilities reducing the economies of scale (higher costs). When these designs are developed using discrete components these inefficiencies are exacerbated.

This paper considers the verification of non-standard CAN network topologies of the physical layer at high speed transmission rate (500.0Kbps and 1.0Mbps). These network topologies including single star, multiple stars, and hybrid topologies (multiple stars in combination with linear bus or with ring topology) are simulated by using behavior modeling language (VHDL-AMS) in comparison to measurement. Throughout the verification process, CAN transceiver behavioral model together with other CAN physical layer simulation components have been proved to be very accurate. The modeling of measurement environment of the CAN network is discussed, showing how to get the measurement and simulation results well matched. This demonstrates that the simulation solution is reliable, which is highly desired and very important for the verification requirement in CAN physical layer design.

In addition to basic switching functionality, smart power switches mainly provide diagnostic and protection functions, e.g. for short circuits to the load, which makes it all the more surprising that short circuit protected smart switches have been used for years in automotive applications without there being a precise definition of a short circuit. This article describes what Infineon has done to fill this gap. It was first necessary to define the kind of short circuits likely to occur in automotive applications and to specify the use and operating points of the smart switches. The next logical step was the standardization of the test circuit and application conditions in the AEC (Automotive Electronics Council) to allow an industry-wide comparison of the test results.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).

This paper focuses on the requirements of electronic systems in automotive applications in terms of reliability and quality. As one of the most common devices in such applications for switching electronic loads, the power MOSFET, is investigated in detail. Today's qualification procedure for discrete devices according to AEC Q101 [1] will be explained and how this correlates to the stress of the device in the application. It will be pointed out what additional tests for “extended qualification” should be made to deal with critical failure modes reducing overly conservative safety margins and preventing excessive costs on the component side. The tests will be explained and the results presented.

For the past approximately 20 years, the Serial Peripheral Interface (SPI) has been the established standard for serial communication between a host or central microprocessor and peripheral devices. This standard has been used extensively in control modules covering the entire spectrum of automotive applications, as well as non-automotive applications. As the complexity of engine control modules grows, with the number of vehicle actuators being controlled and monitored increasing, the number of loads the central microprocessor has to manage is growing accordingly. These loads are typically controlled using discrete and pulse-width modulated (PWM) outputs from the microcontroller when real-time operation is essential or via SPI when real-time response is not critical. The increase of already high pin-count on microcontrollers, the associated routing effort and demand for connected power stages is a concern of cost and reliability for future ECU designs.

This paper will address the electronic development in the wireless industry and compare it to the electronic development in the automotive industry. The wireless industry is characterized by rapid, dramatic high tech changes with a less than two-year cycle time and an equivalent life cycle. The automotive electronics industry is working toward reducing the typical 2 to 3 year development cycle down 1 to 2 years but with a life cycle of 10 years or more. In addition to realizing the electronic development benefits seen in the wireless industry, the automotive industry places significantly more emphasis on the quality and reliability aspects of their designs as many of them are targeted toward, or interface with, safety critical applications. One of the lessons learned from the wireless industry is the development process; where the hardware selection process can be accomplished in a virtual environment in conjunction with concurrent software development.

The increasing legal requirements for safety, emission reduction, fuel economy and onboard diagnosis systems push the market for more innovative solutions with rapidly increasing complexity. Hence, the embedded systems that will have to control the automobiles have been developed at such an extent that they are now equivalent in scale and complexity to the most sophisticated avionics systems. This paper will demonstrate the key elements to provide a powerful, scalable and configurable solution that offers a migration pass to evolution and even revolution of automotive Sensors and Sensor interfaces. The document will explore different architectures and partitioning. Sensor technologies such as magnetic field sensors based on the hall effect as well as bulk and surface silicon micro machined sensors will be mapped to automotive applications by examples. Functions such as self-test, self-calibration and self-repair will be developed.

This paper outlines the results of a study performed to analyze the mission of TTCAN from applications to products for automotive systems. As commonly acknowledged communication is one of the key elements for future and even present systems such as an automobile. A dramatically increasing number of busses and gateways even in low- to midrange vehicles is putting significant burden upon the validation scenario as well as the cost. Accordingly, numerous new initiatives have been started worldwide in order to find solutions to this; some of them by the definition of enhanced or new protocols. This paper shall have a look particular on the new standard of TTCAN (time-triggered communication on CAN). This protocol is based on the CAN data link layer as specified in ISO 11898-1 and may use standardized CAN physical layers such as specified in ISO 11898-2 (high-speed transceiver) or in ISO 11898-3 (fault-tolerant low-speed transceiver).

The increasing complexity of automotive electronic systems can only be managed by a higher integration of the modules and a high reliability of the individual electronic devices. That means, the number of electronic components on board will decrease and their complexity will increase. This paper describes how to meet the requirements for the power supply of a 32-bit microcontroller based system in an automotive environment.

The C166 family, based on a 16-bit core; it is nowadays an enormous success in automotive, in particular in PowerTrain. This component is the right answer for the automotive real time applications of today. It is with both, automotive customer requirements and a long automotive experience in semi-conductors that this new generation 32-bit family is borne. The objective of this document is to provide and comment on automotive requirements in terms of the new micro-controller, to show the benefits for the applications and explain how the AUDO architecture fulfils these requirements.

New generation microcontrollers for automotive applications require a huge number of I/Os, dealing with various sensor and actuator signals derived from the external world. In case of the first TriCore™ based 32-Bit microcontroller this leads to approximately 270 I/Os for signal processing. Adding the power supply lines and thermal balls, the overall number of required interconnects grows far over 300. To outperform standard microcontroller packages, e.g. QFPs, the limitations in terms of package size and maximum number of interconnects have to be improved. Main goal is to adapt the component quality to the high level reliability standard, which is the basis of an implementation into automotive parts. Current tests with a P-BGA standard package show interesting results for the board level reliability, when design and test parameters are changed only slightly.