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Technical Paper

The Role of Climatic Conditions on Disc Brake Noise

2006-10-08
2006-01-3209
Since the brake colloquium in 2004 the role of climatic conditions and their relations to noise occurrence, sound pressure level and friction coefficient level is widely discussed in the US and European working groups on brake noise. A systematic study has been started to investigate the influence of relative humidity, absolute humidity and temperature on brake noise and the corresponding friction coefficient level. In this study an enormous effort was taken to keep the influences of the brake parameters, e.g. lining material, Eigenfrequencies and dimensions of the different components as small as possible to investigate the climatic influence only. Strategic humidity and temperature levels were tested according to the Mollier-Entropy-Enthalpy-Diagram which are corresponding to the seasons in the various international regions. A regression analysis evaluates the correlation and the influence of each parameter to noise and friction coefficient level.
Technical Paper

Integrated Barometric Pressure Sensor with SMD Packaging: Example of Standardized Sensor Packaging

1996-02-01
960756
A single-chip integrated barometric pressure sensor using bulk silicon micromachining will be presented in this paper. The sensor chip incorporates the complete signal evaluation and trimming of the temperature coefficients and manufacturing tolerances. Sensor chips are mounted onto 6″ × 4″ thick film substrates for batch processing during assembly and trimming. The separated, individual devices can be used for surface mounting (SMD) on a printed circuit board (PCB). Specifications for the sensor functions, as well as the assembly and packaging concept, will be discussed. Assembly, trimming and packaging are the most expensive production steps in the manufacture of sensors. In order to reduce the costs for sensors, we are introducing a standardization of sensor assembly and trimming with batch processing capability: after dicing, the integrated sensor chip is attached to a 6″ × 4″ thick film ceramic substrate with standard die-attaching glue.
Technical Paper

The ABS 6S/4K - A Modular System for Simplified Installation in Tractors, Semi-trailers and Trailers

1990-10-01
902213
Today's ABS sytems for commercial vehicles and trailers reflect specific solutions for individual vehicle model wiring and control features. In addition, the chassis mounting requirements for trailer applications uses a separate sealed housing for the relay and other sensitive components. A logical progression of design development resulted in the new ABS 6S/4K open system with the ability of being adaptable to specific vehicle control requirements. A variety of different component arrangements can be accommodated. Accordingly, it does not require a standard wiring harness. Wiring is left optional for the specific vehicle configuration. The housing may be frame mounted without any special protection and therefore can cover both trailer and tractor applications. The housing is designed to provide necessary protection from water and dirt. The electronic senses the peripheral component configuration via a simple “learning” procedure.
Technical Paper

Application Possibilities and Future Chances of “Smart” Sensors in the Motor Vehicle

1989-02-01
890304
Current vehicle concepts necessitate the multiple measurement of several variables required by separate electronic systems in the motor vehicle. There is the need to make sensors bus capable by the incorporation of electronic components in new definition concepts, in other words to make them multiply usable. Such bus concepts are at the present time taking concrete shape. The step of introducing electronics - especially digital - to the measuring point may simultaneously be used to considerably improve utilization of the information content of sensor structures using means of indivdual, digital correction to a greater level than has until now been technically possible. There remains the demand for high stability and reproducibility of the sensor properties over time. These signal preprocessing and information condensation processes on the spot also satisfy the need to relieve the central control units.
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