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For aircraft electromechanical actuator (EMA) cooling applications using forced air produced by axial fans, the main objective in fan design is to generate high static pressure head, high volumetric flow rate, and high efficiency over a wide operating range of rotational speed (1x∼3x) and ambient pressure (0.2∼1 atm). In this paper, a fan design based on a fan diameter of 86 mm, fan depth (thickness) of 25.4 mm, and hub diameter of 48 mm is presented. The blade setting angle and the chord lengths at the leading and trailing edges are varied in their suitable ranges to determine the optimal blade profiles. The fan static pressure head, volumetric flow rate, and flow velocity are calculated at various ambient pressures and rotational speeds. The optimal blade design in terms of maximum total-to-total pressure ratio and efficiency at the design point is obtained via CFD simulation. A 5-blade configuration yields the best performance in terms of efficiency and total pressure ratio.

The aircraft electromechanical actuator (EMA) cooling fan is a critical component because an EMA failure caused by overheating could lead to a catastrophic failure in aircraft. Fault tree analysis (FTA) is used to access the failure probability of EMA fans with the goal of improving their mean time to failure (MTTF) from ∼O(5×104) to ∼ O(2.5×109) hours without incurring heavy weight penalty and high cost. The dual-winding and dual-bearing approaches are analyzed and a contra rotating dual-fan design is proposed. Fan motors are assumed to be brushless direct current (BLDC) motors. To have a full understanding of fan reliability, all possible failure mechanisms and failure modes are taken into account. After summarizing the possible failure causes and failure modes of BLDC fans by focusing on each failure mechanism, the life expectancy of fan ball bearings based on a major failure mechanism of lubricant deterioration is calculated and compared to that provided in the literature.

The scaling laws of fans express basic relationships among the variables of fan static pressure head, volume flow rate, air density, rotational speed, fan diameter, and power. These relationships make it possible to compare the performance of geometrically similar fans in dissimilar conditions. The fan laws were derived from dimensionless analysis of the equations for volumetric flow rate, static pressure head, and power as a function of fan diameter, air density and rotational speed. The purpose of this study is to characterize a fan's performance characteristics at various rotational speeds and ambient pressures. The experimental results are compared to the fan scaling laws.

A power electronics module was equipped with an evaporative spray cooling nozzle assembly that served to remove waste heat from the silicon devices. The spray cooling nozzle assembly took the place of the standard heat sink, which uses single phase convection. The purpose of this work was to test the ability of spray cooling to enable higher power density in power electronics with high temperature coolant, and to be an effective and lightweight system level solution to the thermal management needs of aerospace vehicles. The spray cooling work done here was with 95 °C water, and this data is compared to 100 °C water/ propylene glycol spray cooling data from a previous paper so as to compare the spray cooling performance of a single component liquid to that of a binary liquid such as WPG. The module used during this work was a COTS module manufactured by Semikron, Inc., with a maximum DC power input of 180 kW (450 VDC and 400 A).

Effective thermal management and removal of the waste heat generated at diode arrays is critical to the development of high-power solid-state lasers. Thermal design must be considered in the packaging of these arrays. Two different packages with heat dissipation through spray cooling are evaluated experimentally and numerically. Their overall performance is compared with other packaging configurations using different heat removal approaches. A novel packaging design is proposed that can fulfill the requirements of low thermal resistance, temperature uniformity among emitters in the diode array, low coolant flow rate, simplicity and low assembly cost. The effect of temperature uniformity on the pumping efficiency for gain media is examined for our novel packaging design. The thermal stress induced by temperature variation within an emitter is also considered.