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Standard

Mold Release Agent

2022-10-04
CURRENT
AMS3091C
This specification covers a mold release agent in the form of a liquid.
Standard

Polyimide Printed Circuit Boards Fabrication of

2022-06-05
CURRENT
ARP1612A
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Standard

CLOTH, TYPE "E" GLASS, "B" STAGE POLYIMIDE-RESIN-IMPREGNATED 181 Style Fabric, Low-Flow Addition-Cure Resin For Press Cure at 40 - 100 psi (275 - 690 kPa) or Vacuum/Autoclave Processing

1985-04-01
HISTORICAL
AMS3845/1A
This specification covers one type of glass cloth impregnated with a heat-reactive, addition-cure, thermosetting, polyimide-resin system, the resin to be supplied in a "B" stage condition for low flow and press cure at 40 - 100 psi (275 - 690 kPa) or vacuum/autoclave processing.
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