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This SAE Aerospace Recommended Practice (ARP) is not a certification document; it contains no certification requirements beyond those already contained in existing certification documents. The purpose of this ARP is to provide: a Guidelines for potential usage of life samples depending upon the mission environment and at user discretion to use them or not. b Guidelines of: 1 Who approves the parts to be used. 2 Notification requirements to manufacturers. 3 Traceability and segregation. 4 Packing and labeling of such parts. This ARP does not claim that the recommended practices and artifacts described herein are the only acceptable ones. They are, however, used widely today, and merit serious consideration of potential usage where applicable in the military and space hardware. This ARP does not supersede any contracts or legal agreements between contractual parties.

This document establishes the requirements for screening, qualification, and lot acceptance testing of Plastic Encapsulated Discrete Semiconductors (PEDS) for use in space application environments. The scope of this document is intended for standard silicon based technology only, but the process and methodology described within can be adopted for other technologies such as Silicon Carbide, Gallium Nitride, and Gallium Arsenide. However, when non-silicon based technology parts are being used, the device characterization shall be modified, and it is recommended to use available industry standards based upon published research/testing reports for those technology to address applicable physics of failure.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). Failure-Mechanism-Driven Reliability Monitoring draws upon the concepts and implementation of line controls, process stability, and effective monitoring programs in lieu of qualifying a product based solely on a fixed list of tests. A supplier must identify those failure mechanisms that may be actuated through a given product / process change(s), and must design and implement reliability tests adequate to assess the impact of those failure mechanisms on system level reliability. In order for this to be effective, the supplier establishes a thorough understanding of and linkage to their reliability monitoring program.

This standard documents and establishes common industry practices, and screening and qualification testing, of plastic encapsulated discrete semiconductors (PEDs) for use in military and avionics application environments.

This SAE Aerospace Standard (AS) documents and establishes common industry practices, and screening and qualification testing, of Plastic Encapsulated Microcircuits (PEMs) for use in military and avionics application environments.

This document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments.

This Technical Bulletin covers the following areas of concern. Prevention: Actions recommended for procuring parts and materials with a full warranty; Actions recommended for minimizing risks and protecting your Program from counterfeiting; Actions recommended when buying from a non-authorized supplier. Detection: Actions recommended when procuring parts from an unauthorized supplier or otherwise suspect that a part or material at risk of being counterfeit has been procured. Risk Mitigation: Actions recommended when no reasonable alternatives exist (e.g., a redesign is required, an unacceptable schedule delay will result, the program or customer cannot bear the additional cost) and the decision has been made to procure from a non-authorized supplier.

This Bulletin provides a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware. It is not a mandate nor does it contain any requirements. A tin whisker is a single crystal that emerges from tin-finished surfaces. Tin whiskers can pose a serious reliability risk to electronic assemblies that have pure tin finish. The general risks fall into several categories: [1, 2, 3, 8, 16] Short Circuits: The whisker can create a short circuit, either by 1) growing from an area at one potential to an area at another or 2) breaking free and later bridging these areas. In some cases, these shorts may be permanent and cause catastrophic system failures. A transient short may result if the available current exceeds the fusing current of the whisker, and the whisker can fuse open.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications. This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). Failure-Mechanism-Driven Reliability Monitoring draws upon the concepts and implementation of line controls, process stability, and effective monitoring programs in lieu of qualifying a product based solely on a fixed list of tests. A supplier must identify those failure mechanisms that may be actuated through a given product / process change(s), and must design and implement reliability tests adequate to assess the impact of those failure mechanisms on system level reliability. In order for this to be effective, the supplier establishes a thorough understanding of and linkage to their reliability monitoring program.

This Technical Bulletin covers the following areas of concern.