Technical Paper
Analysis of Thermal Stress on Silicon Nitride Surface Caused by Drop-Wall Interaction at Engine Conditions
2024-04-09
2024-01-2584
The phenomenon of drop-wall interaction plays a crucial role in a wide range of industrial applications. When liquid droplets come into contact with a high-temperature surface, it can lead to thermal shock due to rapid temperature fluctuations. This abrupt temperature change can generate thermal stress within the solid wall material. If the thermal stress exceeds the material's strength in that specific stress mode, it can result in material failure. Therefore, it is imperative to delve into the evolving temperature patterns on high-temperature surfaces to optimize material durability. This study focuses on investigating drop-wall interactions within the context of engine environments. To achieve this, the Smoothed Particle Hydrodynamics (SPH) method is employed to simulate the impact of fuel droplets on a silicon nitride wall. The goal is to understand the heat transfer mechanisms, thermal penetration depths, and temperature distributions within the heated wall.