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As the cost and complexity of modern aircraft systems increases, emphasis has been placed on model-based design as a means for reducing development cost and optimizing performance. To facilitate this, an appropriate modeling environment is required that allows developers to rapidly explore a wider design space than can cost effectively be considered through hardware construction and testing. This wide design space can then yield solutions that are far more energy efficient than previous generation designs. In addition, non-intuitive cross-coupled subsystem behavior can also be explored to ensure integrated system stability prior to hardware fabrication and testing. In recent years, optimization of control strategies between coupled subsystems has necessitated the understanding of the integrated system dynamics.

In this paper, we address the thermal management issues which limit the lifespan, specific power and overall efficiency of an air-cooled rotary Wankel engine used in Unmanned Air Vehicles (UAVs). Our goal is to eliminate the hot spots and reduce the temperature gradients in the engine housing and side plates by aggressive heat spreading using heat pipes. We demonstrate by simulation that, for a specific power requirement, with heat spreading and more effective heat dissipation, thermal stress and distortion can be significantly reduced, even with air cooling. The maximum temperature drop was substantial, from 231°C to 129°C. The temperature difference (measure of temperature uniformity) decreased by 8.8 times (from 159°C to 18°C) for a typical UAV engine. Our heat spreaders would not change the frontal area of the engine and should have a negligible impact on the installed weight of the propulsion assembly.

This paper presents the concept of a dual latent heat sink for thermal management of pulse heat generating electronic systems. The focus of this work is to verify the effectiveness of the concept during charging through experimentation. Accordingly, custom components were built and a prototype version of the heat sink was fabricated. Experiments were performed to investigate the implementation feasibility and heat transfer performance. It is shown that this heat sink is practicable and helps in arresting the system temperature rise during charging (period of pulse heat load).

A power electronics module was equipped with an evaporative spray cooling nozzle assembly that served to remove waste heat from the silicon devices. The spray cooling nozzle assembly took the place of the standard heat sink, which uses single phase convection. The purpose of this work was to test the ability of spray cooling to enable higher power density in power electronics with high temperature coolant, and to be an effective and lightweight system level solution to the thermal management needs of aerospace vehicles. The spray cooling work done here was with 95 °C water, and this data is compared to 100 °C water/ propylene glycol spray cooling data from a previous paper so as to compare the spray cooling performance of a single component liquid to that of a binary liquid such as WPG. The module used during this work was a COTS module manufactured by Semikron, Inc., with a maximum DC power input of 180 kW (450 VDC and 400 A).

Advances in the past decade of the energy and power densities of lithium-ion based batteries for hybrid electric vehicles and various consumer applications have been substantial. Rechargeable high rate lithium-ion batteries are now exceeding 6 kW/kg for short discharge times (<15 seconds). Rechargeable lithium-ion polymer batteries, for applications such as remote-control aircraft, are achieving simultaneously high energy density and high power density (>160 Whr/kg at >1.0 kW/kg). Some preliminary test data on a rechargeable lithium-ion polymer battery is presented. The use of high rate rechargeable lithium-ion batteries as a function of onboard power, electric laser power level, laser duty cycle, and total mission time is presented. A number of thermal management system configurations were examined to determine system level weight impacts. Lightweight configurations would need a regenerative thermal energy storage subsystem.

Effective thermal management and removal of the waste heat generated at diode arrays is critical to the development of high-power solid-state lasers. Thermal design must be considered in the packaging of these arrays. Two different packages with heat dissipation through spray cooling are evaluated experimentally and numerically. Their overall performance is compared with other packaging configurations using different heat removal approaches. A novel packaging design is proposed that can fulfill the requirements of low thermal resistance, temperature uniformity among emitters in the diode array, low coolant flow rate, simplicity and low assembly cost. The effect of temperature uniformity on the pumping efficiency for gain media is examined for our novel packaging design. The thermal stress induced by temperature variation within an emitter is also considered.

Rotating Heat Pipe (RHP) technolog y is being developed for high speed (>20 krpm) regimes of electric motor/generator cooling. The motivation for this research is the potential application of the high speed RHPs for the thermal management of advanced rotating electrical machines. The passive nature and relatively simple features of this device are attractive for the removal of waste heat from the rotors of electric machines. Interesting air-cooling experimental results of two high speed RHPs designed, fabricated and tested at AFRL are presented here. Emphasis is made on external heat removal concepts useful for cooling the RHP condenser in order to be successful in promoting this technology to real world problems.