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This paper employs a systematic approach to packaging design and testing of a system and its components in order to determine the long term durability of light duty diesel filters. This effort has utilized a relatively new aluminum titanate filter technology as well as an advanced support mat technology engineered to provide superior holding force at lower temperatures while maintaining its high temperature performance. Together, these two new technologies form a system that addresses the unique operating conditions of diesel engines. Key physical properties of both the filter and the mat are demonstrated through laboratory testing. The system behavior is characterized by various laboratory techniques and validation procedures.

Current trends in automotive emissions control have tended towards reduced mass substrates for improved light-off performance coupled with a reduction in PGM levels. This trend has led to increasingly thinner walls in the substrates and increased open frontal areas, with a potential of reducing the overall mechanical strength of the substrate relative to the thicker walled lower cell density supports. This change in demand driven technology has also led to developments, at times costly, in the processing of the catalytic converter system. Changes in mat materials, handling technology and coating variables are only a few sources of overall increased system costs. Corning has introduced the Celcor® XS™ product to the market which significantly increases the strength of thin and ultra thin walled substrates.

Driven by the worldwide automotive emission regulations, ceramic substrates were developed to serve as catalyst support. Since the introduction of Standard wall substrates in 1974, substrates with thinner walls and higher cell densities have been developed to meet the tighter emission requirements; Worldwide, the amount of Thinwall and Ultrathinwall substrates in series applications is increasing continuously. The properties of the substrates determine their performance regarding pressure drop, heat-up and conversion efficiency. These properties are analyzed, as well as the packaging process for Thinwall and Ultrathinwall substrates; A new packaging technique with lower pressure load is described.