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Alternator, which supplies electric energy to a battery and electrical loads when it is rotated by engine via belt, is one of key components to improve vehicle fuel efficiency. We have reduced rectification loss from AC to DC with a MOSFET instead of a rectifier diode. It is important to turn on the MOSFET and off during a rectification period, called synchronous control, to avoid a current flow in the reverse direction from the battery. We turn it off so as to remain a certain conduction period through a body diode of the MOSFET before the rectification end. It is controlled by making a feedback process to coincide with an internal target conduction period based on the rotational speed of the alternator. We reduced a voltage surge risk at turn-off by changing the feedback gain depending on the sign of the time difference between the measured period and the target.

Emission regulations in many countries and regions around the world are becoming stricter in reaction to the increasing awareness of environment protections, and it has now become necessary to improve the performance of catalytic converters to achieve these goals. A catalytic converter is composed of a catalytically active material coated onto a ceramic honeycomb-structured substrate. Honeycomb substrates play the role of ensuring intimate contact between the exhaust gas and the catalyst within the substrate’s flow channels. In recent years, high-load test cycles have been introduced which require increased robustness to maintain low emissions during the wide range of load changes. Therefore, it is extremely important to increase the probability of contact between the exhaust gas and catalyst. To achieve this contact, several measures were considered such as increasing active sites or geometrical surface areas by utilizing substrates with higher cell densities or larger volumes.

Trivalent chromium passivation is used after zinc plating for enhancing corrosion resistance of parts. In the passivating process, the amount of dissolved metal ions (for example zinc and iron) in the passivation solution increases the longer the solution is used. This results in a reduced corrosion resistance at elevated temperatures. Adding a top coat after this process improves the corrosion resistance but has an increased cost. To combat this, we strove to clarify the mechanism of decreased corrosion resistance and to develop a trivalent chromium passivation with a higher corrosion resistance at elevated temperatures. At first, we found that in parts produced from an older solution, the passivation layer has cracks which are not seen in parts from a fresh/new solution. These cracks grow when heated at temperatures over 120 degrees Celsius.

This paper describes the reliability of silicon carbide (SiC) MOSFET. We clarified the relation between the lifetime of the gate oxide and the crystal defects. We fabricated MOS diodes using thermal oxidation and measured their lifetimes by TDDB (Time Dependent Dielectric Breakdown) measurement. The wear-out lifetime is sufficient for hybrid vehicle but many MOS diodes broke in shorter time. The breakdown points were defined by Photo-emission method. Finally, we classified the defects by TEM (Transmission Electron Microscopy). A TSD (Threading Screw Dislocation) plays the most important role in the lifetime degradation of the gate oxide. The lifetime of the gate oxide area, in which a TSD is included, is shorter by two orders of magnitude than a wear-out breakdown. The mechanism by which threading dislocations degrade the gate oxide lifetime was not discovered. To explain the degradation, we assumed two models, the shape effect and the oxide quality degradation.

Measurements of residual stress in a printed circuit board, which consists of copper foil, silver alloy and thermo plastic resin, were conducted under a thermal cycle. The printed circuit board was given a ten-layer repeat of prepreg and made by thermocompression bonding. Experiments suggested the possibility of measuring surface residual stress of copper circuits and the internal residual stress of metallic connections by synchrotron radiation of Spring-8. FEM analysis of the printed circuit board during a thermal cycle was conducted, and the result was adjusted to X-ray stress using absorption correction. X-ray stress during a heat-cycle obtained by synchrotron radiation showed good agreement with stress calculated by FEM analysis.

In recent years, due to a growing demand for improvement in the performance and reliability of automotive fuel pumps and the advancement of globalization, automotive fuel pumps are being used with inferior gasolines that include more sulfur, organic acids or compounds, compared to gasolines used in general regions. Conventionally, bearings in these fuel pumps have mainly been made of sintered bronze alloy. With this bronze alloy, however, it is difficult to achieve a significant improvement in the tribology characteristics of bearings, in order to meet the demands for performance improvement, etc., and corrosion is severe in inferior gasolines that contain highly-concentrated organic acids or sulfur and the corrosion products that accompany them. Therefore, in order to obtain fine tribology characteristics and superior corrosion resistance in gasolines with highly-concentrated organic acids and sulfur, various copper-based alloys were studied using the powder metallurgy process.