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Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.

The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.

One of the most evident trends in automotive sector is miniaturization. It is related to considerable benefits due to the potential of mass reduction, cost reduction and efficiency improvement. It involves many different automobile components and most of them are facing challenges to achieve the targets defined by car makers and final consumers. Specifically for wiring harness, it seems to be many manufacturing and process challenges to be surpassed in order to fully perceive the benefits expected with miniaturization, internally and externally. So this article aims to present an overview of literature as well as reporting of experts on this issue mentioning some of the challenges that global automotive wiring harness manufacturers are facing. Subjects as assembly automation, terminal connection and small gauge cables are discussed in the article and also a general overview of how those problems are being addressed in order to meet customer requirements.

Brazilian automotive market has been growing faster than ever. In order to react properly to market increasing demand in terms of volume and diversity, production systems have to be carefully designed. Traditional manufacturing tends to react to demand increase by outsourcing or investing in new equipments or facilities. Lean thinking suggests that by reducing waste along the value stream it is possible to increase flexibility and freed resources to reduce the investment level required to cope customer’s needs. This paper presents two cases of a system redesign based on the lean manufacturing principles to support the demand.

This paper is about the use of the Six Sigma Methodology, to solve variation problems in the manufacture area, at one of the Delphi Automotive Systems unit that manufacturer electrical harness. The DMAIC framework was followed, the improvements were done, eliminating the rots causes, and the use of Six Sigma methodology, was showed very efficient in solve problems. The methodology power, is in using a structured frame work, the DMAIC (Define-Measure-Analyze-Improve-Control), completing by quality quality tools (Pareto Chart, Five Why's, Cause and Effect Diagram) and statistical analyses, for example: variance analyses, hypotheses tests and Design of Experiments.

Delphi's Zero Resistance Technology (ZRT) is a revolutionary new product/process that enables the reduction of mass and volume from a traditional wiring assembly. ZRT is defined as a minimal (zero) resistance change over time. The ZRT product is an electrical/electronic connection system which provides a viable solution for high density and limited space wiring applications. The ZRT process is a semi-automated wiring harness manufacturing system with flexibility to produce harnesses to the customer demand.

Legal requirements and responsibility for the environment require improved recyclability of car components. This can be achieved by a reduction in the variety of materials used, which can be separated after use. This is being demonstrated for wiring harnesses using a new hook and loop based fastening system. Easier assembly and disassembly, elimination of fixation holes in the car body, and improved serviceability can lead to considerable cost reductions. Field experience on test cars will be available at a later date.

The lateral runout of disc brake corner components can lead to the generation of brake system pulsation. Emphasis on reducing component flatness and lateral runout tolerances are a typical response to address this phenomenon. This paper presents the results of an analytical study that examined the effect that the attachment of the wheel to the brake corner assembly could have on the lateral distortion of the rotor. An analysis procedure was developed to utilize the finite element method and simulate the mechanics of the assembly process. Calculated rotor distortions were compared to laboratory measurements. A statistical approach was utilized, in conjunction with the finite element method, to study a number of wheel and brake corner parameters and identify the characteristics of a robust design.

The increasing features and complexity of today's automotive architectures are becoming increasingly difficult to manage. Each new innovation typically requires additional mechanical actuators and associated electrical controllers. The sheer number of black boxes and wiring are being limited not by features or cost but by the inability to physically assemble them into a vehicle. A new architecture is required which will support the ability to add new features but also enable the Vehicle Assembly Plants to easily assemble and test each subsystem. One such architecture is a distributed multiplex arrangement that reduces the number of wires while enabling flexibility and expandability. Previous versions have had to deal with issues such as noise immunity at high switching currents. The LIN Bus with its low cost and rail-to-rail capability may be the key enabling technology to make the multiplexed architecture a reality.

An algorithm for estimation of vehicle yaw rate and side slip angle using steering wheel angle, wheel speed, and lateral acceleration sensors is proposed. It is intended for application in vehicle stability enhancement systems, which use controlled brakes or steering. The algorithm first generates two initial estimates of yaw rate from wheel speeds and from lateral acceleration. A new estimate is subsequently calculated as a weighted average of the two initial ones, with the weights proportional to confidence levels in each estimate. This preliminary estimate is fed into a closed loop nonlinear observer, which generates the final estimate of yaw rate along with estimates of lateral velocity and side slip angle. Parameters of the observer depend on the estimated surface coefficient of adhesion, thus providing adaptation to changes in road surface coefficient of adhesion.

A recent trend within the automotive industry has been an emphasis on the development of modular assemblies for future vehicle applications. This trend has created a need for the development of methods to predict the performance of modules within the vehicle environment. In particular, the development of system models that account for the interactions between components within a modular assembly is necessary to insure that a module is properly designed. This paper describes a finite element system model of a damper module as installed in a McPherson strut front suspension. The modeling techniques used to construct the components within the modular assembly are discussed. The results of a study of the structural behavior of a damper module model subjected to quasi-static loading conditions are presented. Additionally, the effects of changes in individual component specifications on the overall system response are considered and the results are displayed.

This paper documents the advantages of brake corner system modeling and simulation over traditional component analysis techniques. A better understanding of the mechanical dynamics of the disc-braking event has been gained through brake corner system modeling and simulation. Single component analyses do not consider the load transfer between components during the braking event. Brake corner system analysis clearly quantifies the internal load path and load transfer sequence between components due to clearances or tolerance variations in the brake assembly. By modeling the complete brake corner assembly, the interaction between components due to the contact friction loads and variational boundary conditions can be determined. The end result permits optimal design of brake corner systems having less deflection, lower stress, optimum material mass, and reduced lead-time for new designs.

Automotive wiring assembly design and manufacturing has evolved from a locally based business to a global business. It is common today to engineer the design of a wiring assembly in one region of the world, to manufacture it in a second region, and to assemble it into the vehicle in a third region. This creates a need for global collaboration, training and communications. Design for Manufacturability (DFM) is a tool that can aid in this, in developing common processes globally, and reducing the cost and design complexity of the product in the early design stages. To develop a global DFM process, an organization must develop and implement a strategy. This paper will review the approach that an automotive wiring assembly supplier adopted. It will enumerate the benefits of developing a global Design for Manufacturability process, selecting a champion, and using a twelve-step plan to integrate DFM into each region.

The SuperPlug™ door module is a new Delphi innovation. It is a one-piece composite structure, which integrates several door components into one assembly. This reduces the total part count, simplifies the vehicle level assembly process, and reduces labor cost (see the Appendix). The door slam durability test is an important factor in door module design. As more hardware is integrated into the SuperPlug, this subsystem performance in a door slam test becomes important. Therefore, the correct placement of components and the supporting structure is critical. Currently, the evaluation of door slam durability for the SuperPlug is a process of build then test. This is time consuming and costly due to a long testing lead-time and the expense of tooling a new mold. It was realized that a numerical process for assessing the effect of door slam would be required. This process would compute the dynamic response using finite element analysis (FEA).

Intense competition in the automotive industry requires continuous reduction in innovation cycle time, even as corporations are downsizing and system complexity is increasing. Subsequently, the application of recently introduced Rapid Algorithm Development (RAD) tools has facilitated significant advances in the development of embedded control systems. The RAD steps include system modeling, control algorithm design, simulation analysis, automated calibration design, and vehicle implementation through automatic code generation. The application of RAD tools and the associated benefits are described, specifically in the context of Engine Management Systems (EMS). Such benefits include significant reductions in development cycle time, open architecture, automated calibration, and information reuse.