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Onboard diagnostic regulations require performance monitoring of diesel particulate filters used in vehicle aftertreatment systems. Delphi has developed a particulate matter (PM) sensor to perform this function. The objective of this sensor is to monitor the soot (PM) concentration in the exhaust downstream of the diesel particulate filter which provides a means to calculate filter efficiency. The particulate matter sensor monitors the deposition of soot on its internal sensing element by measuring the resistance of the deposit. Correlations are established between the soot resistance and soot mass deposited on the sensing element. Currently, the sensor provides the time interval between sensor regeneration cycles, which, with the knowledge of the exhaust gas flow parameters, is correlated to the average soot concentration.

Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.

Delphi is developing a new combustion technology called Gasoline Direct-injection Compression Ignition (GDCI), which has shown promise for substantially improving fuel economy. This new technology is able to reuse some of the controls common to traditional spark ignition (SI) engines; however, it also requires several new sensors and actuators, some of which are not common to traditional SI engines. Since this is new technology development, the required hardware set has continued to evolve over the course of the project. In order to support this development work, a highly capable and flexible electronic control system is necessary. Integrating all of the necessary functions into a single controller, or two, would require significant up-front controller hardware development, and would limit the adaptability of the electronic controls to the evolving requirements for GDCI.

Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.

Balancing the fill sequence of multiple cavities in a rubber injection mold is desirable for efficient cure rates, optimized cure times, and consistent quality of all molded parts. The reality is that most rubber injection molds do not provide a consistent uniform balanced fill sequence for all the cavities in the mold - even if the runner and cavity layout is geometrically balanced. A new runner design technique, named “The Vanturi Effect”, is disclosed to help address the inherent deficiencies of traditional runner and cavity layouts in order to achieve a more balanced fill sequence. Comparative analysis of molded runner samples reveals a significant and positive improvement in runner and cavity fill balancing when the Vanturi Effect is integrated into the runner design.

In vehicular mobility context, it is extremely important for the environmental sustainability that the available energy will be used as efficiently as possible, both in the use of internal combustion engines (ICE) as powertrain, as well in the application of Hybrid and Electric Vehicle Motors (HEV/EV). In this comparison, ICE has a lower efficiency when compared to electric motors, wasting much of the potential energy of the fuel in form of heat and noise. On the other hand, the electric vehicles face limitation in autonomy and recharge time, demanding for a more efficient use of energy stored in batteries. This study aims to present emerging technologies for reuse of energy within the automotive context, originally known as “Energy Harvesting” and “Renewable Energies”.

Miniaturization is an important trend in many technology segments, once it can enable innovative applications generating new markets. This trend was begun in electronics industry after World War II and has spawned changes into automotive sector also. For Automotive Wiring Harness, miniaturization is clearly presented in most of the components, mainly because of its benefits like the potential of mass reduction, cost reduction and efficiency improvement. Furthermore the main voice of customer points to cable gauge reduction that represents a considerable challenge for connection manufacturing process due to quality control limitations presented by conventional crimp process for 0,35 [mm₂] cables and smaller. According to that, the scope of this article is to present, in details, a manufacturing process optimization for an alternative and more robust technology of joining copper stranded cables to tin brass terminals used on automotive wiring harness, Resistance Welding.

The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.

One of the most evident trends in automotive sector is miniaturization. It is related to considerable benefits due to the potential of mass reduction, cost reduction and efficiency improvement. It involves many different automobile components and most of them are facing challenges to achieve the targets defined by car makers and final consumers. Specifically for wiring harness, it seems to be many manufacturing and process challenges to be surpassed in order to fully perceive the benefits expected with miniaturization, internally and externally. So this article aims to present an overview of literature as well as reporting of experts on this issue mentioning some of the challenges that global automotive wiring harness manufacturers are facing. Subjects as assembly automation, terminal connection and small gauge cables are discussed in the article and also a general overview of how those problems are being addressed in order to meet customer requirements.

Many companies around the world have adopted the lean thinking as their strategy to operate, in a global market where changes happen all the time. One foundation for the success of lean manufacturing appliance is the continuous improvement approach which has been considered even on company statements, or it can be also considered as part of the genetic code of any enterprise. However, if in one side the continuous improvement thinking, set people mind to look for opportunities of improvement all the time, on other hand these improvements are incremental and they do not have significant impact on company performance on both short-term and medium-term and sometimes, the activities performed by the employees are not sustainable due to the lack of structure to manage and follow up these activities.

The utilization of Laser welding process has increased during last years in several areas of industry, due to many benefits that can be achieved with this technology, such as: flexibility, productivity and quality. Thus, the optimization of Laser welding processes has been considered as a “green field” to be explored by Laser manufacturers, automation companies and process/project engineers. Nowadays there are few researches that provide a roadmap for Laser welding processes improvement that approaches both the aspects and characteristics applied to evaluate the Laser weld application performance. Therefore, this paper has per its main purpose through an exploratory study to provide parameters toward continuous improvement of Laser welding process considering both types of Lasers: Laser spot weld and Laser seam weld of stainless steel joints, thus this work may be considered as theoretical and practical reference to be applied by people involved with Laser welding applications.

Brazilian automotive market has been growing faster than ever. In order to react properly to market increasing demand in terms of volume and diversity, production systems have to be carefully designed. Traditional manufacturing tends to react to demand increase by outsourcing or investing in new equipments or facilities. Lean thinking suggests that by reducing waste along the value stream it is possible to increase flexibility and freed resources to reduce the investment level required to cope customer’s needs. This paper presents two cases of a system redesign based on the lean manufacturing principles to support the demand.

This paper investigates the application of thick film hybrid circuit technology on ceramic substrate in comparison to the main stream substrate FR-4 (Flame Retardant 4) for PCB implementation. The study is based on computer models for these very substrates in order to simulate the propagation of heat through convection and conduction within the material boundaries. In order to simulate electronic components surface mounted, different heat sources are randomly arranged on physical contact to the surface of the material under investigation. The results emphasize and discern the usage of both substrates and its most suitable environment verifying the application towards vehicular integration. Future study may include experimental analysis for simulated data verification and validation of thick film hybrid circuit technology for the automotive industry.

Short timing and complexes strategies are mandatory in a competitive market as automotive industry. Therefore quality problems identification during and after the coding phase, may be the difference between the business success and undesired conflicts with customer, solving problems that were not previously identified. Consequently the usage of technique Mahalanobis Taguchi System (MTS) to analyze coding metrics, create an environment to improve the final product quality and mitigate potential problems later identified.

Dual-monolith catalyst systems containing Pd/Rh three-way catalysts (TWCs) provide effective emission solutions for LEV2/Bin 5 and Bin 4 close-coupled applications at low PGM loadings. These systems combine washcoat technology and PGM distribution for front and rear catalysts resulting in optimal hydrocarbon and NOx light-off and transient NOx control. The dual-catalyst [Pd/Rh + Pd/Rh] systems are characterized as a function of Pd-Rh content, PGM location, and catalyst technology for 4-cyl [close-coupled + underfloor] systems and 6-cyl close-coupled applications. The current Pd/Rh dual-catalyst converters significantly reduce NOx emissions compared to earlier [Pd + Pt/Rh] or [Pd + Pd/Rh] LEV/ULEV systems by utilizing uniform Rh distribution and new OSC materials. These new design strategies particularly impact NOx performance, especially during transient A/F excursions.

Delphi's Zero Resistance Technology (ZRT) is a revolutionary new product/process that enables the reduction of mass and volume from a traditional wiring assembly. ZRT is defined as a minimal (zero) resistance change over time. The ZRT product is an electrical/electronic connection system which provides a viable solution for high density and limited space wiring applications. The ZRT process is a semi-automated wiring harness manufacturing system with flexibility to produce harnesses to the customer demand.

Several heater cores failed due to erosion by cavitation. After analysis, most of failures were explained by the presence of impurities in the heater core. It was then decided with the customer to use CFD simulation in order to prove that the cavitation was not caused by design concept of the tank. In this paper, we present the results of heater core simulations done in 2D and in 3D with Fluent. The objective is to simulate the pressure and velocity distribution within the heater core and to verify if the zones of low pressure are below the saturation vapour pressure of the fluid causing cavitation. In these areas, the deterioration of the tubes might occur due to erosion by cavitation.

Although the Six Sigma [1] concept has become very popular in industrial sectors, very little is said about how to start a successful implementation in a Corporation, or when it should be initiated, and the most important, who should be addressed to lead this task. Its methodologies are widely observed by different sectors of the automotive market, typically focusing in projects with a potential financial impact, following the DMAIC sequence. More than just financial return, this sophisticated tool, has a direct impact on Quality in different levels for both non-productive process and manufacturing process, that eventually would also affect some organizational structures that ultimately can be understood as reengineering.

In recent years, the desire for improved vehicle performance, reliability and safety have increased the electrical content and its complexity in vehicles. Advanced automotive systems integrate sensors, controllers, actuators and communication networks. To maintain safety and reliability, a comprehensive system of diagnostics and physical and analytic redundancy are used. In some cases, diagnostic strategies based on analytical redundancy can provide detection, as well as fault-tolerance, and may provide benefits in cost, packaging, flexibility and reusability. This paper discusses a range of diagnostic methods and their applicability to advanced automotive systems such as X-by-Wire. It will also show the reduction to practice of an advanced analytical technique for an automotive application.

Desiring to push thermoplastic poly-olefin (TPO) technology to its fullest limits and to confirm our position as the leader in the manufacturing of environmentally friendly TPO instrument panels, we have designed a process to manufacture 100% recycled instrument panel skins. This closed-loop process begins with extruding 100% recycled TPO flake into sheet stock to be painted and vacuum formed. The painted sheet is vacuum formed and the offal is ground into regrind flake, ready to be extruded again, thus completing the closed-loop process. This paper will describe a 100% closed loop recycling process for TPO instrument panels, discuss the intense validation process for recycled material and prove the robustness and durability of this interior solution.