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Material creep action under the high temperature is a important factor which should be considered analyzing the pin boss durability. This paper studied the plastic action of the pin boss under the thermomechanical load. As a result, the plastic strain range is smaller than Besides, pin boss damage may be derived from the bigger silicon particle concentration and the bigger iron debris concentration. The enlarged particle deformation under the severe load would cause microfracture between the silicon particles and the aluminum-silicon phase until the part broken.