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Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.

Miniaturization is an important trend in many technology segments, once it can enable innovative applications generating new markets. This trend was begun in electronics industry after World War II and has spawned changes into automotive sector also. For Automotive Wiring Harness, miniaturization is clearly presented in most of the components, mainly because of its benefits like the potential of mass reduction, cost reduction and efficiency improvement. Furthermore the main voice of customer points to cable gauge reduction that represents a considerable challenge for connection manufacturing process due to quality control limitations presented by conventional crimp process for 0,35 [mm₂] cables and smaller. According to that, the scope of this article is to present, in details, a manufacturing process optimization for an alternative and more robust technology of joining copper stranded cables to tin brass terminals used on automotive wiring harness, Resistance Welding.

The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.

Lead-free solders for electronics have been actively pursued since the early 1990's here and abroad for environmental, legislative, and competitive reasons. The National Center for Manufacturing Sciences (NCMS-US)1, the International Tin Research Institute (ITRI-UK)2, Swedish Institute of Production Engineering Research (IVF-Sweden)3, Japan Institute of Electronics Packaging (JIEP Japan)4, Improved Design Life and Environmentally Aware Manufacture of Electronics Assemblies by Lead-free Soldering (IDEALS-Europe)5, and, more recently, the National Electronics Manufacturing Initiative (NEMI-US)6 have been aggressively seeking lead-free solutions The automotive industry has some unique requirements that demand extensive testing of new materials and processes prior to implementation. The specific steps taken at Delphi Automotive Systems with lead-free solder will be described along with the lessons learned along the way.