This specification and its supplementary detail specifications cover corrosion-inhibiting, modified epoxy primers in the form of ready-to-use sprayable liquids.
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.
This document describes an inspection procedure for detecting, by use of a radiographic opaque tracer and fluoroscopy or radiography methods, flaws which have been produced as the result of cutting, machining, or drilling operations in composite or laminate structures.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated carbon fiber unidirectional tape product. This material is intended for use in laminate applications with a service temperature of -65 to 180 °F. The composite may be used for the manufacture of primary and secondary aircraft structure.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated 7781 glass fabric. The prepreg has a nominal fiber areal weight of 294 gsm, and nominal resin content of 38%.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated carbon fiber plain weave fabric product. The prepreg is a plain weave fabric with 12K tows, a nominal fiber areal weight of 193 gsm, and nominal resin content of 42%.
This specification covers one type of glass cloth impregnated with a heat-reactive, thermosetting, solution-addition-type PMR-15 polyimide resin system, supplied in the form of continuous rolls of full width cloth or slit tape.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated carbon fiber plain weave fabric product. The prepreg is a plain weave fabric with 12K tows, a nominal fiber areal weight of 193 gsm, and nominal resin content of 42%.
The purpose of this specification is to allow procurement of a defined material corresponding to the statistically derived material properties published in CMH-17 Volume II.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated 7781 glass fabric. The prepreg has a nominal fiber areal weight of 294 gsm, and nominal resin content of 38%.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated 7781 glass fabric. The prepreg has a nominal fiber areal weight of 294 gsm, and nominal resin content of 38%.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated carbon fiber plain weave fabric product. The prepreg is a plain weave fabric with 12K tows, a nominal fiber areal weight of 193 gsm, and nominal resin content of 42%.
The purpose of this specification is to allow procurement of a defined material corresponding to the statistically derived material properties published in MIL-HDBK-17.
This specification covers one type of glass cloth impregnated with a heat-reactive, thermosetting, solution-addition-type PMR-15 polyimide resin system, supplied in the form of continuous rolls of full width cloth or slit tape.