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Standard

Polyimide Printed Circuit Boards Fabrication of

2022-06-05
CURRENT
ARP1612A
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Standard

Carbon Fiber and Fiberglass Epoxy/Prepreg Products with 350 °F (177 °C) Cure for Aerospace Applications: Type 40, Class 1, Grade 196, Style 6K-PW

2020-12-29
CURRENT
AMS6891/2
The intent of this specification is for the procurement of the material listed on the QPL; therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program must refer to the Quality Assurance section of this base specification, AMS6891.
Standard

Carbon Fiber and Fiberglass Epoxy Prepreg Products with 350 °F (177 °C) Cure for Aerospace Applications: Type 35, Class 1, Grade 191

2020-12-29
CURRENT
AMS6891/1
The intent of this specification is for the procurement of the material listed on the QPL; therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program must refer to the Quality Assurance section of this base specification, AMS6891.
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