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This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). Failure-Mechanism-Driven Reliability Monitoring draws upon the concepts and implementation of line controls, process stability, and effective monitoring programs in lieu of qualifying a product based solely on a fixed list of tests. A supplier must identify those failure mechanisms that may be actuated through a given product / process change(s), and must design and implement reliability tests adequate to assess the impact of those failure mechanisms on system level reliability. In order for this to be effective, the supplier establishes a thorough understanding of and linkage to their reliability monitoring program.

This standard documents and establishes common industry practices, and screening and qualification testing, of plastic encapsulated discrete semiconductors (PEDs) for use in military and avionics application environments.

This SAE Aerospace Standard (AS) documents and establishes common industry practices, and screening and qualification testing, of Plastic Encapsulated Microcircuits (PEMs) for use in military and avionics application environments.

This Bulletin provides a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware. It is not a mandate nor does it contain any requirements. A tin whisker is a single crystal that emerges from tin-finished surfaces. Tin whiskers can pose a serious reliability risk to electronic assemblies that have pure tin finish. The general risks fall into several categories: [1, 2, 3, 8, 16] Short Circuits: The whisker can create a short circuit, either by 1) growing from an area at one potential to an area at another or 2) breaking free and later bridging these areas. In some cases, these shorts may be permanent and cause catastrophic system failures. A transient short may result if the available current exceeds the fusing current of the whisker, and the whisker can fuse open.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). Failure-Mechanism-Driven Reliability Monitoring draws upon the concepts and implementation of line controls, process stability, and effective monitoring programs in lieu of qualifying a product based solely on a fixed list of tests. A supplier must identify those failure mechanisms that may be actuated through a given product / process change(s), and must design and implement reliability tests adequate to assess the impact of those failure mechanisms on system level reliability. In order for this to be effective, the supplier establishes a thorough understanding of and linkage to their reliability monitoring program.

This Technical Bulletin covers the following areas of concern.