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Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

The reduction of vehicle exhaust particle emissions is a success story of European legislation. Various particle number (PN) counters and calibration procedures serve as tools to enforce PN emission limits during vehicle type approval (VTA) or periodical technical inspection (PTI) of in-use vehicles. Although all devices and procedures apply to the same PN-metric, they were developed for different purposes, by different stakeholder groups and for different target costs and technical scopes. Furthermore, their calibration procedures were independently defined by different stakeholder communities. This frequently leads to comparability and interpretation issues. Systematic differences of stationary and mobile PN counters (PN-PEMS) are well-documented. New, low-cost PTI PN counters will aggravate this problem. Today, tools to directly compare different instruments are scarce.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.

In terms of modern technical systems, the automotive sector is characterized by escalating complexity and functionality requirements. The development of embedded control systems has to meet highest demands regarding process-, time- and cost-optimization. Hence, the efficiency of software development becomes a crucial competitive advantage. Systems design engineers need effective tools and methods to achieve exemplary speed and productivity within the development phase. To obtain such tools and methods, semiconductor manufacturers and tool manufacturers must work closely together. Within the joint efforts of ETAS and Infineon, the software tool suite ASCET-SD was enhanced to generate efficient C code for Infineon's TriCore architecture mapped on ETAS's real-time operating system ERCOSEK. The processor interface to application & calibration tools was realized using the ETK probe based on a JTAG/Nexus link at very high bandwidth.

A joint study was conducted between BMW and Goodyear with the objective of analysing the cause and identifying methods to reduce the structure-borne interior noise in a vehicle driving on rough road surfaces. A vibro-acoustic characterization of the car was performed by measuring the car vibro-acoustic transfer functions and by using a transfer path analysis technique to identify the main suspension parts affecting the interior noise at target frequencies. The vibration transmissibility characteristics of the tire were measured and also simulated by Finite Element in [1-200Hz] frequency range. The vibro-acoustic interaction between the tire and car sub-systems was examined. A Finite Element sensitivity analysis was used to define and build new prototype tires. A 3dB(A) interior noise improvement was obtained with these new tires at target frequencies.

A new simulation tool was established and approved by TRW as part of the continuous improvement of the development process. This tool allows the OEM and the system supplier to keep high quality even with further reduced development times. The introduction of the tool in a side air-bag development program makes it possible to ensure high development confidence with a reduced number of vehicle crash tests and late availability of interior component parts.

The automotive industry experiences a major change as vehicles are gradually becoming a part of the Internet. Security concepts based on the closed-world assumption cannot be deployed anymore due to a constantly changing adversary model. Automotive Ethernet as future in-vehicle network and a new E/E Architecture have different security requirements than Ethernet known from traditional IT and legacy systems. In order to achieve a high level of security, a new multi-layer approach in the vehicle which responds to special automotive requirements has to be introduced. One essential layer of this holistic security concept is to restrict non-authorized access by the deployment of embedded firewalls. This paper addresses the introduction of automotive firewalls into the next-generation domain architecture with a focus on partitioning of its features in hardware and software.

Over the past decades, interior noise from wind noise or engine noise have been significantly reduced by leveraging improvements of both the overall vehicle design and of sound package. Consequently, noise sources originating from HVAC systems (Heat Ventilation and Air Conditioning), fans or exhaust systems are becoming more relevant for perceived quality and passenger comfort. This study focuses on HVAC systems and discusses a Flow-Induced Noise Detection Contributions (FIND Contributions) numerical method enabling the identification of the flow-induced noise sources inside and around HVAC systems. This methodology is based on the post-processing of unsteady flow results obtained using Lattice Boltzmann based Method (LBM) Computational Fluid Dynamics (CFD) simulations combined with LBM-simulated Acoustic Transfer Functions (ATF) between the position of the sources inside the system and the passenger’s ears.

ISO 26262 is the actual standard for Functional Safety of automotive E/E (Electric/Electronic) systems. One of the challenges in the application of the standard is the distribution of safety related activities among the participants in the supply chain. In this paper, the concept of a Safety Element out of Context (SEooC) development will be analyzed showing its current problematic aspects and difficulties in implementing such an approach in a concrete typical automotive development flow with different participants (e.g. from OEM, tier 1 to semiconductor supplier) in the supply chain. The discussed aspects focus on the functional safety requirements of generic hardware and software development across the supply chain where the final integration of the developed element is not known at design time and therefore an assumption based mechanism shall be used.

The potential to reduce the cost of embedded software by standardizing the application behavior for Automotive Body and Comfort domain functions is explored in this paper. AUTOSAR, with its layered architecture and a standard definition of the interfaces for Body and Comfort application functions, has simplified the exchangeability of software components. A further step is to standardize the application behavior, by developing standard specifications for common Body and Comfort functions. The corresponding software components can be freely exchanged between different OEM/Tier-1 users, even if developed independently by multiple suppliers. In practice, individual OEM users may need to maintain some distinction in the functionality. A method of categorizing the specifications as ‘common’ and ‘unique’, and to configure them for individual applications is proposed. This allows feature variability by means of relatively simple adapter functions.

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.

The environmental impact of the automobile and its components is of growing importance not only in public debates but also in the complex decision making process regarding future car concepts. To calculate the environmental compatibility of car components BMW has developed various quantifying instruments and a holistic Life-Cycle Analysis (LCA) approach. The development phase significantly affects the entire life-cycle of a product. Suitable design criteria, recycling requirements and in-house standards have therefore been developed and established. One of the most important objectives in optimizing the environmental compatibility of the automobile is the realization of intelligent lightweight concepts. This means one has to find the most appropriate solution in terms of ecology and economy. Due to modern development processes car manufacturers and their suppliers have to intensify their cooperation also in this area.

The signal delivery and quality of sensor data is of growing importance for modern automotive control applications. Sensors tend to be calibrated subsystems that are designed to stay in a defined tolerance and thus can easily be modeled. Compared to this deterministic behavior the transmission channel is time variant due to EMC and aging of contacts for example. The use of analog signaling, which is the actual state of realization in many cases, is sensitive to the time variant effects mentioned before. This time variance is hard to consider for the control system development. In this paper we will analyze the role of the sensor in the signal supply chain and discuss approaches for digital sensor-ECU communication and their potential to establish a link, which allows neglecting low level effects of the channel.

How can car manufacturers, which are primary mechanical engineers, become software specialists? This is a question of prime importance for car electronics in the future. Modern vehicles offer a large number of electronic and software based functions to achieve a high level of safety, fuel economy, comfort, entertainment and security which are developed under pressure of regulations, of consumers needs and of competitive time to market aspects. This contribution draws a picture, what could be important in future for in car communication and information system in terms of development process, HW & SW architectures, partnerships in automotive industry and security of industrial properties. For this purpose the automotive development is reviewed and actual examples of system designs are given.

The new generation of drive-by-wire systems currently under development has demanding requirements on the electronic architecture. Functions such as brake-by-wire or steer-by-wire require continued operation even in the presence of component failures. The electronic architecture must therefore provide fault-tolerance and real-time response. This in turn requires the operating system and the communication layer to be predictable, dependable and composable. It is well known that this properties are best supported by a time-triggered approach. A consortium consisting of German and French car manufacturers and suppliers, which aims at becoming a working group within the OSEK/VDX initiative, the OSEKtime consortium, is currently defining a specification for a time-triggered operating system and a fault-tolerant communication layer.1 The operating system and the communication layer are based on applicable interfaces of the OSEK/VDX standard.

In order to optimise the vibro-acoustic behaviour of panel-like structures in a more systematic way, accurate structural models are needed. However, at the frequencies of relevance to the vibro-acoustic problem, the mode shapes are very complex, requiring a high spatial resolution in the measurement procedure. The large number of required transducers and their mass loading effects limit the applicability of accelerometer testing. In recent years, optical measuring methods have been proposed. Direct electronic (ESPI) imaging, using strobed continuous laser illumination, or more recently, pulsed laser illumination, have lately created the possibility to bring the holographic testing approach to the level of industrial applicability for modal analysis procedures. The present paper discusses the various critical elements of a holographic ESPI modal testing system.

From an acoustical point of view, the integration of seatbelt retractors in a vehicle is a real challenge that has to be met early in the vehicle development process. The buzz and rattle noise of seat belt retractors is a weak yet disturbing interior noise. Street irregularities excite the wheels and this excitation is transferred via the car body to the mounting location of the retractor. Ultimately, the inertia sensor of the locking mechanism is also excited. This excitation can be amplified by structural resonances and generate a characteristic impact noise. The objective of this paper is to describe a simulation method for an early development phase that predicts the noise-relevant low frequency local modes and consequently the contact of the retractor with the mounting panel of the car body via the finite element method.

Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive.