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Technical Paper

New Evaluation Method for Thermal Shock Resistance of Honeycomb Substrates

2016-04-05
2016-01-0931
Honeycomb substrates are widely used to reduce harmful emissions from gasoline engines and are exposed to numerous thermal shocks during their lifetime making thermal shock resistance one of the key factors in designing honeycomb substrates. More stringent emission regulations will require the honeycomb substrates to be lighter in weight to improve light-off performance and to have better thermal shock resistance than conventional honeycomb substrates to handle higher expected temperature gradients. Thermal shock resistance is generally evaluated on a substrate by evaluating the thermal strain caused by temperature gradients inside the substrate during durability testing [1,2]. During the test, a heated substrate is cooled at a surface face to generate temperature gradients while the temperature inside the honeycomb substrate is monitored by multiple thermocouples.
Technical Paper

Achieving SULEV30 Regulation Requirement with Three-Way Catalyst on High Porosity Substrate while Reducing Platinum Group Metal Loading

2022-03-29
2022-01-0543
Fleet average SULEV30 emissions over FTP-75 must be met under full implementation of US Tier 3/LEV III emission regulation in 2025. The majority of SULEV30 certified 2021 model year vehicles are equipped with ≤ 2L displacement engines and some models adopt hybrid powertrain systems. Pickup trucks account for > 20% of passenger vehicles in the US. They could represent a quick route to meet fleet average SULEV30 targets. The newest pickup truck models are typically ULEV50 or ULEV70 certified. To reach SULEV30 or lower emission category, total tailpipe emissions must be reduced by more than 40%. Improvement of cold start emission is essential because over 70% of regulated emission is emitted during the first 60 seconds of a drive cycle with current engine and aftertreatment technology. High porosity (HP) ceramic substrate is designed to reduce thermal mass and time required to reach three-way catalyst (TWC) active temperature compared to conventional ceramic substrates.
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