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Spot, or distributed, cooling and heating is an energy efficient way of delivering comfort to an occupant in the car. This paper describes an approach to distributed cooling in the vehicle. A two passenger CFD model of an SUV cabin was developed to obtain the solar and convective thermal loads on the vehicle, characterize the interior thermal environment and accurately evaluate the fluid-thermal environment around the occupants. The present paper focuses on the design and CFD analysis of the energy efficient HVAC system with spot cooling. The CFD model was validated with wind tunnel data for its overall accuracy. A baseline system with conventional HVAC air was first analyzed at mid and high ambient conditions. The airflow and cooling delivered to the driver and the passenger was calculated. Subsequently, spot cooling was analyzed in conjunction with a much lower conventional HVAC airflow.

Delphi Automotive Systems and BMW are jointly developing Solid Oxide Fuel Cell (SOFC) technology for application in the transportation industry primarily as an on-board Auxiliary Power Unit (APU). In the first application of this joint program, the APU will be used to power an electric air conditioning system without the need for operating the vehicle engine. The SOFC based APU technology has the potential to provide a paradigm shift in the supply of electric power for passenger cars. Furthermore, by supplementing the conventional fuel with reformate in the internal combustion engine, extremely low emissions and high system efficiencies are possible. This is consistent with the increasing power demands in automobiles in the new era of more comfort and safety along with environmental friendliness. Delphi Automotive Systems and BMW were successful in demonstrating an Auxiliary Power Unit (APU) based on Solid Oxide Fuel Cell (SOFC) technology in February, 2001.

In this paper, finite element shape optimization is used to determine the optimum air cleaner shape and rib design for low shell noise. Shape variables are used to vary the height and location of rib elements, as well as vary the shape of the air cleaner surfaces. The optimization code evaluates each design variation and selects a search direction that will reduce surface velocity. Sound power radiation is calculated for each optimized design using an acoustic code. Large reductions in shell noise were achieved by optimizing the shape of the air cleaner surface and rib design. Optimization of the rib pattern alone yielded a local optimization, as opposed to a global optimization that represented the best possible design.

Optimization of the mechanical aspects of a heated conical oxygen sensor for desired performances, such as low heater power, good poison resistance, fast light-off, and broad temperature range, etc. was achieved with computer modeling. CFD analysis was used to model the flow field in and around a sensor in an exhaust pipe to predict the convection coefficients, poisoning, and switching time. Heat transfer analysis coupled with electrical heating was applied to predict temperature and light-off time. Results of the optimization are illustrated, with good agreements between modeling and testing.

In the catalytic converter, the thermal conductivity of the insulation material (intumescent mat) placed between the ceramic catalyst and the metal shell is strongly dependent on the temperature, resulting in the solving of non-linear heat conduction equations. In this paper, the analytic solution for the steady heat flow in a cylinder with temperature dependent conductivity is given. Using this analytic solution for the mat and including convection and radiation at the converter skin, an analytical expression for calculating converter skin temperature is obtained. This expression can be easily incorporated in a Fortran code to calculate the temperatures.

Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.