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This paper investigates the application of the Hybrid FE-SEA method to the prediction of the Transmission Loss (TL) of a front-of-dash component. SEA subsystems are used to represent the source and receiving chambers of a TL test suite and an FE structural subsystem is used to represent the dash component. The potential advantages of the Hybrid FE-SEA method for this application are that: (i) it can provide detailed narrowband predictions of the radiation efficiency and TL of a given component across a broad frequency range and (ii) the computational cost of the approach is typically several orders of magnitude less than that of traditional low frequency FE/BEM/IEM methods. The approach is also potentially well suited to existing analysis processes since information from detailed component level models can be used to update and refine targets obtained from system level SEA models (the use of a common environment for such models simplifies model management).

It has the aim to discuss the evolution of electronics components, integrated circuits, new transistors concepts and associate its importance in the automotive modules. Today, the challenge is to have devices which consume less power, suitable for high-energy radiation environment, less parasitic capacitances, high speed, easier device isolation, high gain, easier scale-down of threshold voltage, no latch-up and higher integration density. The improvement of those characteristics mentioned and others in the electronic devices enable the automotive industry to have a more robust product and give the possibility to integrate new features in comfort, safety, infotainment and telematics modules. Finally, the intention is to discuss advanced structures, such as the silicon-on-insulator (SOI) and show how it affects the electronics modules applied for the automotive area.