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Delivering the appropriate material data for CAE analysis of plastic components is not as straight forward as it would seem to be. While a few of the properties typically used by resin manufacturers and material engineers to describe a plastic are useful to the analysis community (density, CLTE), most are not (flexural modulus, notched izod). In addition some properties such as yield stress are defined differently by the analysis community than by the materials community. Lastly, secondary operations such as painting or chrome plating significantly change the behavior of components with plastic substrates. The materials engineering community and the CAE analysis community must work together closely to develop the material data necessary to increase the capability of the analysis. This paper will examine case studies where these issues have required modifications to the material property data to increase the fidelity of the CAE analysis.

Decoratively plated plastic parts continue to be in high demand. One of the essential and challenging features of these finished goods is the adhesion between the metal plating and the plastic. As is the case with any bond between metals and plastics, combating the force from dissimilar thermal growth is an ongoing concern. When a plated plastic part is frozen and the plastic contracts, the failure mode for the plating manifests as a blister or “worm track”. On the other hand, when high heat causes plating failures from growth of the plastic, the problem is one of cracking in the plating. In this study, two methods are discussed that provide insight into the strength of the bond between the metal plating and the ABS and ABS+PC plastics. Peel testing is one means to evaluate the strength of the plating to plastic bond. Peel testing methodology and results are reported for both ABS and ABS+PC samples. A second means to evaluate the bond strength is through thermal cycle testing.