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The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

The BMW Group has introduced electric cars to the market with the MINI E already in 2009. The next step will be the launch of the BMW ActiveE in 2011, followed by the revolutionary Mega City Vehicle in 2013. The presentation will explain the BMW Group strategy for implementing sustainable mobility. A focus will be emobility, the use of carbon fiber and the holistic sustainability approach of BMW Group?s project i. Reference will be made to the research results of the MINI E projects in the US and in Europe. Presenter Andreas Klugescheid, BMW AG

Recently, vehicle networks have increased complexity due to the demand for autonomous driving or connected devices. This increasing complexity requires high bandwidth. As a result, vehicle manufacturers have begun using Ethernet-based communication for high-speed links. In order to deal with the heterogeneity of such networks where legacy automotive buses have to coexist with high-speed Ethernet links vehicle manufacturers introduced a vehicle gateway system. The system uses Ethernet as a backbone between domain controllers and CAN buses for communication between internal controllers. As a central point in the vehicle, the gateway is constantly exchanging vehicle data in a heterogeneous communication environment between the existing CAN and Ethernet networks. In an in-vehicle network context where the communications are strictly time-constrained, it is necessary to measure the delay for such routing task.

Highly automated driving (HAD) is under rapid development and will be available for customers within the next years. However the evidence that HAD is at least as safe as human driving has still not been produced. The challenge is to drive hundreds of millions of test kilometers without incidents to show that statistically HAD is significantly safer. One approach is to let a HAD function run in parallel with human drivers in customer cars to utilize a fraction of the billions of kilometers driven every year. To guarantee safety, the function under test (FUT) has access to sensors but its output is not executed, which results in an open loop problem. To overcome this shortcoming, the proposed method consists of four steps to close the loop for the FUT. First, sensor data from real driving scenarios is fused in a world model and enhanced by incorporating future time steps into original measurements.

Today's automotive software integration is a static process. Hardware and software form a fixed package and thus hinder the integration of new electric and electronic features once the specification has been completed. Usually software components assigned to an ECU cannot be easily transferred to other devices after they have been deployed. The main reasons are high system configuration and integration complexity, although shifting functions from one to another ECU is a feature which is generally supported by AUTOSAR. The concept of a Virtual Functional Bus allows a strict separation between applications and infrastructure and avoids source code modifications. But still further tooling is needed to reconfigure the AUTOSAR Basic Software (BSW). Other challenges for AUTOSAR are mixed integrity, versioning and multi-core support. The upcoming BMW E/E-domain oriented architecture will require all these features to be scalable across all vehicle model ranges.

The reduction of vehicle exhaust particle emissions is a success story of European legislation. Various particle number (PN) counters and calibration procedures serve as tools to enforce PN emission limits during vehicle type approval (VTA) or periodical technical inspection (PTI) of in-use vehicles. Although all devices and procedures apply to the same PN-metric, they were developed for different purposes, by different stakeholder groups and for different target costs and technical scopes. Furthermore, their calibration procedures were independently defined by different stakeholder communities. This frequently leads to comparability and interpretation issues. Systematic differences of stationary and mobile PN counters (PN-PEMS) are well-documented. New, low-cost PTI PN counters will aggravate this problem. Today, tools to directly compare different instruments are scarce.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

In the present work we investigated experimentally and computationally the unsteady flow around a BMW car model including wheels*. This simulation yields mean flow and turbulence fields, enabling the study aerodynamic coefficients (drag and lift coefficients, three-dimensional/spatial wall-pressure distribution) as well as some unsteady flow phenomena in the car wake (analysis of the vortex shedding frequency). Comparisons with experimental findings are presented. The computational approach used is based on solving the complete transient Reynolds-Averaged Navier-Stokes (TRANS) equations. Special attention is devoted to turbulence modelling and the near-wall treatment of turbulence. The flow calculations were performed using a robust, eddy-viscosity-based ζ - ƒ turbulence model in the framework of the elliptic relaxation concept and in conjunction with the universal wall treatment, combining integration up to the wall and wall functions.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

Innovative electric systems demand a new approach for the distribution of electric energy in passenger cars. This paper describes a very promising solution-the dual voltage power network with an upper voltage level of 42V, and the considerations which led to the selection of this voltage level. Owing to the significant impact on the industry, a common standard is required. Depending on their profile, OEMs will select their own strategies for implementation, either as a base for innovation or to enhance overall system efficiency. This will lead to different approaches and timeframes.

This paper describes a practical approach to extract the global static stiffness of a body in white (BIW) from dynamic measurements in free-free conditions. Based on a limited set of measured frequency response functions (FRF), the torsional and bending stiffness values are calculated using an FRF based substructuring approach in combination with inverse force identification. A second approach consists of a modal approach whereby the static car body stiffness is deduced from a full free-free modal identification including residual stiffness estimation at the clamping and load positions. As an extra important result this approach allows for evaluating the modal contribution of the flexible car body modes to the global static stiffness values. The methods have been extensively investigated using finite element modeling data and verified on a series of body in white measurements.

Infineon's latest high-end automotive microcontrollers like TC1796 are complex Systems On Chip (SoC) with two processor cores and up to two internal multi-master buses. The complex interaction between cores, peripherals and environment provides a big challenge for debugging. For mission critical control like engine management the debugging approach must not be intrusive. The provided solution are dedicated Emulation Devices which are able to deal with several 10 Gbit/s of raw internal trace data with nearly no cost adder for mass production and system design. Calibration, which is used later in the development cycle, has different requirements, but is covered by the Emulation Devices as well. The architecture of TC1796ED comprises the unchanged TC1796 silicon layout, extended by a full In-Circuit Emulator (ICE) and calibration overlay memory on the same die. In most cases, the only debug/calibration tool hardware needed is a USB cable.

As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.

In terms of modern technical systems, the automotive sector is characterized by escalating complexity and functionality requirements. The development of embedded control systems has to meet highest demands regarding process-, time- and cost-optimization. Hence, the efficiency of software development becomes a crucial competitive advantage. Systems design engineers need effective tools and methods to achieve exemplary speed and productivity within the development phase. To obtain such tools and methods, semiconductor manufacturers and tool manufacturers must work closely together. Within the joint efforts of ETAS and Infineon, the software tool suite ASCET-SD was enhanced to generate efficient C code for Infineon's TriCore architecture mapped on ETAS's real-time operating system ERCOSEK. The processor interface to application & calibration tools was realized using the ETK probe based on a JTAG/Nexus link at very high bandwidth.

A new simulation tool was established and approved by TRW as part of the continuous improvement of the development process. This tool allows the OEM and the system supplier to keep high quality even with further reduced development times. The introduction of the tool in a side air-bag development program makes it possible to ensure high development confidence with a reduced number of vehicle crash tests and late availability of interior component parts.

A mechatronic approach to implementing a BLDC motor drive control system is described. The partitioning method used allows the motor power to be scaled from around 100 watts to 1 kilowatt. The chosen approach maps the required electronic functionality to different existing front-end technologies. By drawing on vast experience with back-end technologies, especially chip-on-chip assembly, it is possible to implement a system in a one-package solution. The advantages of each technology are used to achieve a cost-effective, space-saving solution.

Based on the example of a door soft close automatic the potential of integrated system simulation in the automotive systems development is demonstrated. The modeling approach is covering several physical domains like mechanics, electromagnetics and semiconductor physics. With adequate simplifying methods a time efficient model is generated, which allows system optimization in the concept phase. Time consuming redesigns can thus be minimized.

In defining innovative and cost-effective chip sets for future automotive applications, system architects need high-level tools that allow them to rapidly determine the best silicon partitioning for a given application in terms of system performance as well as cost. The tool needs to be flexible, modular, and swift such that the system designer can perform abstract simulation iterations quickly for various functional partitioning scenarios, without requiring excessive computer resources. The tool must also be portable and adaptable to provide a simulation environment suitable to systems- or car-manufacturers for in-depth applications simulation and architecture assessment. The semiconductor component definition process using such a “mission-level” design tool for the automotive application electronic valve will be demonstrated. Methods for the analysis of electronic valve control system architectures using mission-level simulation will be developed.

A cooperation of several research partners supported by the German Federal Ministry of Research and Education proposes a new active matrix LED light source. A multi pixel flip chip LED array is directly mounted to an active driver IC. A total of 1024 pixel can be individually addressed through a serial data bus. Several of these units are integrated in a prototype headlamp to enable advanced light distribution patterns in an evaluation vehicle.