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Journal Article

Effect of Illumination Angle on the Performance of Dusted Thermal Control Surfaces in a Simulated Lunar Environment

2009-07-12
2009-01-2420
JSC-1A lunar simulant has been applied to AZ93 and AgFEP thermal control surfaces on aluminum substrates in a simulated lunar environment. The temperature of these surfaces was monitored as they were heated with a solar simulator using varying angles of incidence and cooled in a 30 K coldbox. Thermal modeling was used to determine the solar absorptivity (a) and infrared emissivity (e) of the thermal control surfaces in both their clean and dusted states. It was found that even a sub-monolayer of dust can significantly raise the α of either type of surface. A full monolayer can increase the α/ε ratio by a factor of 3–4 over a clean surface. Little angular dependence of the α of pristine thermal control surfaces for both AZ93 and AgFEP was observed, at least until 30° from the surface. The dusted surfaces showed the most angular dependence of α when the incidence angle was in the range of 25° to 35°.
Technical Paper

Abrasion of Candidate Spacesuit Fabrics by Simulated Lunar Dust

2009-07-12
2009-01-2473
A protocol has been developed that produced the type of lunar soil abrasion damage observed on Apollo spacesuits. This protocol was then applied to four materials (Kevlar®, Vectran®, Orthofabric, and Tyvek®) that are candidates for advanced spacesuits. Three of the four new candidate fabrics (all but Vectran®) were effective at keeping the dust from penetrating to layers beneath. In the cases of Kevlar® and Orthofabric this was accomplished by the addition of a silicone layer. In the case of Tyvek®, the paper structure was dense enough to block dust transport. The least abrasive damage was suffered by the Tyvek®. This was thought to be due in large part to its non-woven paper structure. The woven structures were all abraded where the top of the weave was struck by the abrasive. Of these, the Orthofabric suffered the least wear, with both Vectran® and Kevlar® suffering considerably more extensive filament breakage.
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