Search Results

Nano-silver sintered bonding was carried out at 275°C and under 3MPa pressures, and soldering in a vacuum reflowing oven to reduce voiding. Both joints are subject to large shear stresses due to the mismatch in coefficients of thermal expansion (CTE) between the chip and the substrate. In this study, residual stresses in the chip-on-substrate assemblies were determined by measuring the bending curvatures of the bonded structures. An in-house optical setup measured the bending curvatures using a thin-film stress measurement technique. From the measured bending curvatures and the mechanical properties of the constituent materials, residual stresses were calculated. The thermo-mechanical reliabilities of both joining techniques were tested by thermal cycling. The chip assemblies were cycled between -40°C and 125°C (100 minutes of cycle time, 10 minutes of dwell time) and the changes in their bending curvatures were measured.

Analysis and design of total temperature probes for accurate measurements in hot, high-speed flows remains a topic of great interest in aerospace propulsion and a number of other engineering areas. Despite an extensive prior literature on the subject, prediction of error sources from convection, conduction and radiation is still an area of great concern. For hot-flow conditions, the probe is normally mounted in a cooled support, leading to substantial axial conduction along the length of the probe. Also, radiation plays a very important role in most hot, high-speed conditions. One can apply detailed computational methods for simultaneous convection, conduction and radiation heat transfer, but such approaches are not suitable for rapid, routine analysis and design studies. So, there is still a place for low-order approximate methods, and that is the subject of this paper.