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The purpose of this procedure is to establish a technique for reliably and repeatedly measuring the RF shielding characteristics of EMI conductive gasket materials and EMI conductive gaskets. Depending on the materials used for the construction of the measuring setup, the EMI conductive gaskets can be characterized against various joint surfaces. This standard will directly provide shielding effectiveness values up to 40 GHz, and will also be applicable for small samples of conductive EMI gaskets.

This document establishes the minimum requirements for the electrical bonding and grounding of electric, avionic, armament, communication, and electronic equipment installations for aeronautical and aerospace applications. The bonding and grounding requirements specified herein are to ensure that an adequate low resistance return path for electric, avionic, armament, communication and electronic equipment is achieved which can withstand operating conditions and corrosion. This is essential for the reduction of coupling of electromagnetic fields into or out of the equipment as well as for providing electrical stability to control the currents and/or voltages caused by static charges and discharges and for suppressing the hazardous effects thereof.