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For vibration and acoustics vehicle development, one of the main challenges is the identification and the analysis of the noise sources, which is required in order to increase the driving comfort and to meet the stringent legislative requirements for the vehicle noise emission. Transfer Path Analysis (TPA) is a fairly well established technique for estimating and ranking individual low-frequency noise or vibration contributions via the different transmission paths. This technique is commonly applied on test measurements, based on prototypes, at the end of the design process. In order to apply such methodology already within the design process, a contribution analysis method based on dynamic substructuring of a multibody system is proposed with the aim of improving the quality of the design process for vehicle NVH assessment and to shorten development time and cost.

A growing development of hybrid or fully electrical drives increases the demand for an accurate prediction of noise and vibration characteristics of electric and electronic components. This paper describes the numerical and experimental investigation of noise emissions from power electronics, as one of the new important noise sources in electric vehicles. The noise emitted from the printed circuit board (PCB) equipped with multi-layer ceramic capacitors (MLCC) is measured and used for the calibration and validation of numerical model. Material properties are tuned using results from experimental modal analysis, with special attention to the orthotropic characteristic of the PCB glass-reinforced epoxy laminate sheet (FR-4). Electroacoustic excitation is pre-calculated using an extension of schematic-based EMC simulation and applied to the structural model. Structural vibrations are calculated with a commercial FEM solver with the modal frequency response analysis.