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This paper presents two newly developed technologies of optimizing impurity diffusion concentration for silicon semiconductor material and controlling internal stress of the top SiN (Silicon Nitride) layer on a membrane of a silicon substrate to apply them to the manufacturing process of MEMS (Micro Electro Mechanical Systems) type air-flow sensor chips. Until today, in MEMS-type airflow sensors, poly-crystalline silicon (poly-Si) and platinum were widely used as a resistor material of key functional elements on a membrane of air-flow-rate measurement portion. The functional resistors on the membrane are required to monitor high temperatures of about 300 °C and to perform the self-heating operations at that temperature range because of the suppression of contaminant deposition by means of evaporation or incineration.

Down-sizing and dielectric insulation were required for the traction motors of hybrid vehicles. By utilizing the newly developed coil with thick resin insulation atop the conventional enamel film, the use of conventional inter-phase insulation paper was abolished. Furthermore, by adopting the stair-shaped coil structure and spiral winding configuration, the stator size was minimized. With the above technologies, the motor installation to smaller hybrid vehicles was realized, thus contributing to weight reduction of hybrid vehicles.